Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. |
MO-111-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369. |
MO-113-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422. |
MO-112-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. |
MO-115-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357 |
MO-114-C | |
Committee(s): JC-11 Free download. Registration or login required. |