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Title	Document #	Date
Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Package	MO-337B	Feb 2022
Designator: PDMA-N262-I0p5-R69p6x3p7Z30p15R2p55x02p35 Item: 11.14-207, Access STP Files for MO-337B Cross Reference: SO-024 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket	SO-024A	Apr 2019
Item 14-193 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin SODIMM, 0.50 mm Pitch Package	MO-337A	Apr 2019
Item 14-192 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.	MO-179-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357	MO-114-C
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM	MO-309F	Mar 2015
Item No. 11.14-176 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH	MO-314A.02	Jul 2016
Item 14-183, Minor Editorial Revision A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309.	TO-265-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.	MO-198-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.	MO-064-C
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly	MO-347A	Mar 2021
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Item: 11.11-987, Access STP Files for MO-347A Cross Reference: N/A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF	MO-312A	Feb 2013
Item No. 11-875 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Quad Flat Pack (QFP).	TO-271-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Small Outline Package (SOP). Item 11.10-358	TO-269-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.	MO-072-B
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.	MO-175-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.	MO-223-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF	MO-319A	Feb 2016
Item No. 11-912 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.	MO-092-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278.	MO-034-C
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.	MO-170-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.	MO-116-B
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.	MO-160-B
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.	MO-185-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly	MO-335A	Apr 2021
Designator: PDMA-N84-I0p6-R85p13xY#Z#R1p98x0p43 Item: 11.14-191, Access STP Files for MO-335A Cross Reference: N/A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 88 Pin Memory Card. Item 11.14-012.	MO-171-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF	MO-327A	Sep 2016
Item No. 11-925 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.	MO-214-B	Sep 2002
0.50 mm Lead Centers A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of numerous N4 body sizes to variations AE and AF of Low Profile Matrix Tray for Handling and Shipping Thin Grid Array Devices Registration. Item 11.5-634.	CO-034-D	Feb 2003
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of Variation AB to Flange-Mounted Header Family. Item 11.10-307.	TO-259-B
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406	MO-169-B	Nov 2000
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.	MO-017-B
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA	MO-330A	Jun 2018
Item 11.11-955 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA	MO-304D	Jul 2013
Item 11.11-882 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.	MO-234E	Jun 2018
Item 11.11-954 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA	MO-318B	Jan 2017
Item 11.11-934 Outline Cross Reference: Design Registration 4.14 (DR4.14) A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Battery Cell R/A SMT Type Connector, 1.2 mm Pitch	SO-028A	Oct 2021
Designator: PSXC-L6_I1p2-R11p6x5p85Z2p07-R0p3x0p6ET0p07 Item: 11.14-198, Access STP Files for SO-028A Cross Reference: N/A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Battery Cell R/A T/H Type Connector, 1.2 mm Pitch	SO-026A	Oct 2021
Designator: PSXC-P6_I1p2-R11p6x5p85Z2p0-R0p3x0p31H1p16 Item: 11.14-198, Access STP Files for SO-026A Cross Reference: N/A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Battery Cell Wire Side Connector, 1.2 mm pitch	SO-027A	Sep 2021
Designator: PBXC-q6_i1P2-r7P9X4P25z1P58 Item: 11.14-199, Access STP Files for SO-027A Cross Reference: N/A A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280.	MO-098-A
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Package

Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket

Registration - 262 Pin SODIMM, 0.50 mm Pitch Package

Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.

Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357

Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM

Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH

Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309.

Registration - 3-Tier Family. PQFP-B. Item 11.11-473.

Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.

Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly

Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF

Registration - 4 Lead Quad Flat Pack (QFP).

Registration - 4 Lead Small Outline Package (SOP). Item 11.10-358

Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.

Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.

Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF

Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.

Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278.

Registration - 68 Pin (Type I), 68-Pin (Type II) and 88 Pin Memory Card. Item 11.14-010.

Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.

Registration - 72 Pin Dual-In-Lin Memory Module (DIMM) Family with 1.27 mm Contact Centers. Variations AA-CC. Addition of 84 Contact Variation. Item 11.14-017.

Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.

Registration - 84 Pin DDIMM, 0.60 mm Pitch Microelectronic Assembly

Registration - 88 Pin Memory Card. Item 11.14-012.

Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF

Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.

Registration - Addition of numerous N4 body sizes to variations AE and AF of Low Profile Matrix Tray for Handling and Shipping Thin Grid Array Devices Registration. Item 11.5-634.

Registration - Addition of Variation AB to Flange-Mounted Header Family. Item 11.10-307.

Registration - Addition of variations, BA, BB, BC, and BD, to Plastic, Surface Mounted Header Family. Item 11.10-406

Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.

REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA

Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA

Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA

REGISTRATION - Battery Cell R/A SMT Type Connector, 1.2 mm Pitch

REGISTRATION - Battery Cell R/A T/H Type Connector, 1.2 mm Pitch

Registration - Battery Cell Wire Side Connector, 1.2 mm pitch

Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280.

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