Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Stud Hex Base Family, Flexible Leads. Variations AA-AE. Ref. TO-49, TO-93, TO-94, TO108, TO-118. |
TO-209-A | |
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Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064. |
MO-032-C | |
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Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233. |
MO-070-A | |
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Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283. |
MO-104-A | |
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Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358. |
MO-135-C | |
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Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353. |
MO-176-A | |
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Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402. |
MO-223-A | |
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Standard Practices and Procedures - Document Procedure. |
SPP-001 | |
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Registration - Terminal Strip Family Power Module. Variations AA-AB. |
TO-240-B | |
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Standard - Tape Automated Bonding (TAB) Package Family. S-PQUC-X/TAB. |
US-001-B | |
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RESCINDED - Tape Quad Flatpack Family. |
MO-102-A | |
Committee(s): JC-11 |
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Registration - Thick Matrix Tray for BGA. Item 11.5-435. |
CO-028-B | |
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Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB. |
MO-005-B | |
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Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138. |
MO-044-A | |
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Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224. |
MO-081-A | |
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Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302. |
MO-115-A | |
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Registration - Power PQFP with Heat Slug. Item 11.11-559. |
MO-188-B | |
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Registration - Ceramic Header Axial 3-Lead. |
TO-260-A | |
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Registration - Flatpack Family, 22.86 mm Width, 1.27 Pitch. Variations AA-AB. |
MO-023-C | |
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Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385). |
MO-058-B | |
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Registration - Top Brazed Ceramic Quadpack Family .025 inch Pitch, 100 Leads. Variations AA-AF. Item 11.10-264. |
MO-090-B | |
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Registration - Multilayer Ceramic Quad Flatpack .025 Spacing Gullwing (196 Leads). Item 11.10-303. |
MO-125-A | |
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Registration - Plastic SO with Heat Slug, 20, 24, 30, 36 leads. Addition of a 44 lead (0.65 mm pitch) Plastic Heat Slug Package. Variations AA-AE. Item 11.11-551. |
MO-166-D | |
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Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507. |
MO-209-A | |
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Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S. |
MS-022-B | |
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Registration - Stud Hex Base Family, Solid Terminals. Variations AE-AG. Ref. TO-103. |
TO-208-C | |
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Registration - 3 Lead Plastic Flange-Mounted Package. Item 11.10-401 |
TO-274-A | |
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Replaced - See MS-026-C. Item 11.11-483S. |
MO-136-A | |
Committee(s): JC-11 |
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Registration - Gullwing Plastic Surface Mount. Item 11.10-359. |
DO-216-A | |
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Registration - Single-In-Line (SIP) Family. Item 11.3-79. |
MO-035-A | |
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Registration - Plastic Quad Flatpack .025 inch Lead Spacing (Gullwing). Item 11.11-285. |
MO-069-B | |
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Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383 |
MO-103-B | |
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Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311. |
MO-139-A | |
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Standard Practices and Procedures - Pin #1 Mark Function and Location. |
SPP-002 | |
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Registration - Header Family, Peripheral Terminal. Variations AA-AB. (SOT-89). Item 11.10-213. |
TO-243-C | |
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Registration - Flange-Mounted Family, Axial Lead, 7.62/8.25 Pin Circle. |
MO-014-C | |
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Registration - Single-In-Line Power Module. Item 11.3-128. |
MO-045-A | |
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Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA-AB. Item 11.11-218. |
MO-080-A | |
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Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357 |
MO-114-C | |
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Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440. |
MO-152-C | |
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