Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701. |
MO-259-A | Mar 2005 |
Free download. Registration or login required. |
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ACCEPTED PRACTICES FOR MAKING MICROELECTRONIC DEVICE THERMAL CHARACTERISTICS TESTSStatus: Rescinded |
JEB20 | Jan 1975 |
Committee(s): JC-11 |
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ANNUAL UPDATING SERVICE: |
JEP95 AUS | Jan 2000 |
Subscription to this updating service is available from the JEDEC Office. New outlines are shipped to subscribers for insertion into the appropriate sections of Publication No. 95. JEP95 and Updating Service can be ordered through JEDEC at (703)907-7540 or ptanner@jedec.org. Committee(s): JC-11 |
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DDR4 260 Pin SODIMM Connector Performance Standard |
PS-003A.01 | Jul 2016 |
This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E Patents(): FOXCONN US PATENT NO.: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11.14 Free download. Registration or login required. |
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DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5 |
PS-005A.01 | Aug 2021 |
Committee(s): JC-11.14 Free download. Registration or login required. |
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DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES |
JESD30I | Aug 2019 |
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-962. Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array (BGA)Package Measuring and Methodology. |
DG-4.17C | Jul 2008 |
Item 11.2-791(S) Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) |
DR-4.27F.01 | Nov 2018 |
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) |
DR-4.14J.01 | Feb 2019 |
Item 11.2-948E Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA) |
DR-4.5N.01 | Nov 2018 |
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide. |
DG-4.7F | Jan 2014 |
Item 11.2-829R Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).Status: RescindedFebruary 2015 |
DR-4.6D.01 | Jul 2012 |
This outline has been replaced by Design Registration 4.5J and Design Registration 4.27C. |
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Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA) |
DG-4.25B | Aug 2016 |
This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-896(S) Free download. Registration or login required. |
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Design Requirements - Fine-pitch, Square Ball Grid Array Package (FBGA) Package-on-Package (PoP). |
DR-4.22C.02 | Mar 2011 |
Item 11.2-839(R) Free download. Registration or login required. |
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Design Requirements - General Requirements |
DG-4.2 | Jan 1980 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Generic Matrix Tray for Handling and Shipping (Low Stacking Profile for BGA Packages). |
DG-4.9A | Mar 2000 |
Item 11.2-539S Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature. |
DG-4.10D | Oct 2002 |
Item 11.2-615s Free download. Registration or login required. |
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Design Requirements - Internal Stacking Module, Land Grid Array Packages with External Interconnect Terminals (ISM). |
DG-4.21A | Feb 2007 |
Item 11.2-699(S) Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Metric Small Outline J-Leaded Package Design Guide |
DG-4.13 | Aug 1996 |
Free download. Registration or login required. |
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Design Requirements - Micropillar Grid Array (MPGA) |
DR-4.26B | Nov 2015 |
Item 11.2-845(R) Free download. Registration or login required. |
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Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N. |
DG-4.8C | Sep 2006 |
Item 11.2-713(s) Free download. Registration or login required. |
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Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON. |
DG-4.16A | Feb 1998 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN. |
DG-4.23A | Nov 2005 |
Item 11.2-728(S) Free download. Registration or login required. |
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Design Requirements - Quad Flatpack |
DG-4.4A | Jun 2000 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN. |
DG-4.19D | May 2007 |
Item 11.2-765(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN) |
DG-4.24B | Aug 2016 |
Item 11.2-850(S) Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON). |
DG-4.20F | Sep 2016 |
Item 11.2-820(S) Free download. Registration or login required. |
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Design Requirements - Thin Small Outline Package, TSOP - Type 2. |
DG-4.15B | May 2004 |
Item 11.2-675(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Wafer Level Ball Grid Arrays (WLBGA). |
DR-4.18A.01 | Apr 2021 |
Item 11.2-965(E) Free download. Registration or login required. |
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DESIGN REQUIRMENTS FOR OUTLINES OF SOLID STATE AND RELATED PRODUCTS: DISCONTINUED AS A SEPARATE ITEM. NOW CONTAINED IN JEP95, BOOK 1, SECTION 4.Status: Incorporated |
JESD95-1 | Jan 2000 |
Committee(s): JC-11 |
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JEDEC REGISTERED AND STANDARD OUTLINES FOR SOLID STATE AND RELATED PRODUCTS: |
JEP95 | Jan 2000 |
This publication is a compilation of some 1800 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers and package interface BGA outlines in both inch and metric versions. Committee(s): JC-11 |
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JEP95 Registrations Main Page |
JEP95 Index | Apr 2001 |
This page will provide a link to the Master Index for JEP95. It also provides a link to 'index by device type' as well as the table of contents for each section within JEP95. For older outlines that have been archived, they can be accessed through this page. Committee(s): JC-11 |
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PART MODEL ASSEMBLY PROCESS CLASSIFICATION GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-A100 | Feb 2018 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |
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PART MODEL ASSEMBLY PROCESS CLASSIFICATION SCHEMA |
JEP30-A101X | Mar 2018 |
In conjunction with JEP30-A100, for user support this file is the entire “Part Model Assembly Process Classification Schema” (JEP30-10 Part Model Schema, JEP30-A101 Part Model Assembly Process Classification Schema, and JEP30-D10 Part Model Schema Types Dictionary). Committee(s): JC-11 Free download. Registration or login required. |
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PART MODEL ELECTRICAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-E100 | Apr 2018 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |
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PART MODEL ELECTRICAL SCHEMA |
JEP30-E101X | Apr 2018 |
In conjunction with JEP30-E100, for user support, this file is the entire “Part Model Electrical Schema” (JEP30-10 Part Model Schema, JEP30-e101 Part Model Thermal Schema, and JEP30-D10 Part Model Schema Types Dictionary). Committee(s): JC-11.2 Free download. Registration or login required. |
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PART MODEL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30 | Feb 2018 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. Committee(s): JC-11.2 Free download. Registration or login required. |
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PART MODEL PACKAGE GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-P100.01 | May 2018 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |
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PART MODEL PACKAGE SCHEMA |
JEP30-P101X | Mar 2018 |
In conjunction with JEP30-P100, for user support thiis file is the entire “Part Model Package Schema” (JEP30-10 Part Model Schema, JEP30-P101 Part Model Package Schema, and JEP30-D10 Part Model Schema Types Dictionary). Committee(s): JC-11 Free download. Registration or login required. |
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PART MODEL THERMAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS |
JEP30-T100 | Mar 2018 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. Committee(s): JC-11.2 Free download. Registration or login required. |