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Title	Document #	Date
Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-017C.01	Apr 2016
Item No. 14-181(E) Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-016C.01	Apr 2016
Item No. 14-181(E) Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF	MO-319A	Feb 2016
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Micropillar Grid Array (MPGA)	DR-4.26B	Nov 2015
Item 11.2-845(R) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline	SO-018D	Oct 2015
Item No. 14-180 Patents(): Foxconn: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Performance Standard - DDR4 288 Pin U/R/LR DIMM Connector Performance Standard	PS-002A	Jul 2015
This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR4 connectors in client and server platforms. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM	MO-309F	Mar 2015
Item No. 11.14-176 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch	SO-021A	Feb 2015
Item No. 11.14-174 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA	MO-315A	Feb 2015
Item No. 11-903 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Surface Mount Power Package with fused leads. H-PSOF	MO-299B	Jan 2015
Item 11.11-902 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.	MO-286B	Jan 2015
Item 11.10-450 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Registered and Standard Outlines	SPP-013A	Oct 2014
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM	MO-274D	Oct 2014
Item 11.14-171 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA	MO-313A	Aug 2014
Item No. 11-892 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Grid Array Terminal Position Numbering	SPP-010B	May 2014
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Outline, Plastic Surface Mount C-Bend	DO-218C	Apr 2014
Item No. 10-454 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM	MO-269J	Apr 2014
Item 11.14-163 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM	MO-268E	Mar 2014
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM	MO-310C	Feb 2014
Item No. 11.14-164 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT	SO-020A	Jan 2014
Item No. 11.14-153 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.	DG-4.7F	Jan 2014
Item 11.2-829R Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)	DO-201B	Nov 2013
Item 11.10-453 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS	MO-305C	Oct 2013
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Surface Mounted Header Family. H-PSIP-G.	TO-263F	Sep 2013
Item No. 10-452 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA	MO-304D	Jul 2013
Item 11.11-882 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.	MO-207N	Jun 2013
Item 11.4-846 Committee(s): JC-11, JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors	SPP-023B	Feb 2013
Item 11.11-781(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF	MO-312A	Feb 2013
Item No. 11-875 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.	SO-008B	Oct 2012
Item 11.14-141 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.	MO-240C	Aug 2012
Item 11.11-860 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON	MO-229F	Aug 2012
Item 11.11-861 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA). Status: RescindedFebruary 2015	DR-4.6D.01	Jul 2012
This outline has been replaced by Design Registration 4.5J and Design Registration 4.27C. Item 11.2-838(S), 11-893R, 11-894R Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page
Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.	MO-244D	Jul 2012
Item No. 14-136 Patents(): Hitachi: 5,227,664 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA	MO-308A	Apr 2012
Item 11.11-853 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch	MO-303B	Mar 2012
Item No. 11.11-857 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.	MO-296B	Jan 2012
Item 11.11-849 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA	MO-307A	Dec 2011
Item 11.11-856 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD 0.80 mm Pitch Socket Outline. SKT	SO-015A	Dec 2011
Item 11.14-133 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F	TO-281A	Nov 2011
Item 11.11-854 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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JEDEC Education Series: Memory, Mobile & Modules

Standards & Documents Search

Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF

Design Requirements - Micropillar Grid Array (MPGA)

Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline

Performance Standard - DDR4 288 Pin U/R/LR DIMM Connector Performance Standard

Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM

Registration - mSATA SSD Assembly. DIM.

Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch

Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA

Registration - Surface Mount Power Package with fused leads. H-PSOF

Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.

Standard Practices and Procedures - Registered and Standard Outlines

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM

Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA

Standard Practices and Procedures - Grid Array Terminal Position Numbering

Registration - Power Outline, Plastic Surface Mount C-Bend

Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM

Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM

Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM

Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT

Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.

Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)

Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS

Registration - Plastic Surface Mounted Header Family. H-PSIP-G.

Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA

Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.

Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors

Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM), 0.8 mm Pitch, Socket Outline.

Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

Design Requirements - Fine pitch, Rectangular Ball Grid Array Packages (FRBGA).

Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.

Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA

Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch

Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. H-PQFN, HL-PQFN.

Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA

Registration - mSATA SSD 0.80 mm Pitch Socket Outline. SKT

Registration - Fully Molded Flange Header Family, Full-Pak. B2E-PSIP-F

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