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Title	Document #	Date
Registration - Flange Mounted Family, Surface Mount, Peripheral Terminals. R-PSFM-G.	TO-252F	Feb 2017
Item 11.10-456 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA	MO-318B	Jan 2017
Item 11.11-934 Outline Cross Reference: Design Registration 4.14 (DR4.14) Patents(): May apply: National – 4688152, 4778641, 4868349. Citizen – 4822550, 4935581 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).	DG-4.20F	Sep 2016
Item 11.2-820(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF	MO-327A	Sep 2016
Item No. 11-925 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA)	DG-4.25B	Aug 2016
This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-896(S) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN)	DG-4.24B	Aug 2016
Item 11.2-850(S) Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.	MO-302C	Aug 2016
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-326A	Aug 2016
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-325A	Aug 2016
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA	MO-324A	Aug 2016
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Socket Outline, 0.91 mm Pitch. SKT	SO-022A	Aug 2016
Item No. 14-182 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH	MO-314A.02	Jul 2016
Item 14-183, Minor Editorial Revision Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
DDR4 260 Pin SODIMM Connector Performance Standard	PS-003A.01	Jul 2016
This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E Patents(): FOXCONN US PATENT NO.: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-017C.01	Apr 2016
Item No. 14-181(E) Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-019C.01	Apr 2016
Item 14-181(E) Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT	SO-016C.01	Apr 2016
Item No. 14-181(E) Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF	MO-319A	Feb 2016
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Micropillar Grid Array (MPGA)	DR-4.26B	Nov 2015
Item 11.2-845(R) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline	SO-018D	Oct 2015
Item No. 14-180 Patents(): Foxconn: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Performance Standard - DDR4 288 Pin U/R/LR DIMM Connector Performance Standard	PS-002A	Jul 2015
This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR4 connectors in client and server platforms. Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Small Outline, Flat Lead, surface mount package. R-PDSO-F2. Item 10-455.	DO-219C	May 2015
Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM	MO-309F	Mar 2015
Item No. 11.14-176 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - mSATA SSD Assembly. DIM.	MO-300C	Mar 2015
Item 11.14-175 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch	SO-021A	Feb 2015
Item No. 11.14-174 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA	MO-315A	Feb 2015
Item No. 11-903 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.	MO-286B	Jan 2015
Item 11.10-450 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Surface Mount Power Package with fused leads. H-PSOF	MO-299B	Jan 2015
Item 11.11-902 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Registered and Standard Outlines	SPP-013A	Oct 2014
Item 11.2-886(E). This document has been editorially updated to provide template examples. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM	MO-274D	Oct 2014
Item 11.14-171 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA	MO-313A	Aug 2014
Item No. 11-892 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Grid Array Terminal Position Numbering	SPP-010B	May 2014
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Power Outline, Plastic Surface Mount C-Bend	DO-218C	Apr 2014
Item No. 10-454 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM	MO-269J	Apr 2014
Item 11.14-163 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM	MO-268E	Mar 2014
Item 11.14-151 Patents(): Hatachi: 5,227,664 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM	MO-310C	Feb 2014
Item No. 11.14-164 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT	SO-020A	Jan 2014
Item No. 11.14-153 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.	DG-4.7F	Jan 2014
Item 11.2-829R Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)	DO-201B	Nov 2013
Item 11.10-453 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS	MO-305C	Oct 2013
Item No. 11.4-881 Patents(): Qualcomm: US2010/0300743; UTAC: US7824960, US7883938, US7948095B2, US2008/0303031, US2008/0303163, US2010/0209142, US2010/0109169, US2010/0261313 Committee(s): JC-11, JC-11.4, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Flange Mounted Family, Surface Mount, Peripheral Terminals. R-PSFM-G.

Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.

Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA

Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON).

Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF

Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA)

Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN)

Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA.

Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA

Registration - 12 Pin UFS Socket Outline, 0.91 mm Pitch. SKT

Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH

DDR4 260 Pin SODIMM Connector Performance Standard

Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT

REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT

Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF

Design Requirements - Micropillar Grid Array (MPGA)

Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline

Performance Standard - DDR4 288 Pin U/R/LR DIMM Connector Performance Standard

Registration - Plastic, Small Outline, Flat Lead, surface mount package. R-PDSO-F2. Item 10-455.

Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM

Registration - mSATA SSD Assembly. DIM.

Registration - DDR4 MiniDIMM SMT 288 pin socket outline 0.50 mm pitch

Registration - Dual Pitch Number Ball Grid Array Family, Square, 0.80 mm Major, 0.65 mm Minor Pitch. (T,V)F-SBGA

Registration - Plastic Small Outline, Wide Body SOIC, 7.5 Body Width, 0.65 Pitch. R-PDSO.

Registration - Surface Mount Power Package with fused leads. H-PSOF

Standard Practices and Procedures - Registered and Standard Outlines

Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM

Registration - Fine Pitch Ball Grid Array Family, Square, 0.50 mm pitch. (T, V) F-SBGA

Standard Practices and Procedures - Grid Array Terminal Position Numbering

Registration - Power Outline, Plastic Surface Mount C-Bend

Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM

Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM

Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM

Registration - DDR3 Single Sided SODIMM 204 Pin Socket Outline with 0.60 mm Pitch. SKT

Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.

Registration - Lead Mounted Family, Axial Type, Chamfer (Round) Body Diode. PALF (Ref. DO-27, DO-32, DO-39)

Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS

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