Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package |
MO-316B | Apr 2019 |
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 Free download. Registration or login required. |
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Registration - 262 Pin SODIMM, 0.50 mm Pitch Package |
MO-337A | Apr 2019 |
Item 14-192 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket |
SO-024A | Apr 2019 |
Item 14-193 Committee(s): JC-11.14 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) |
DR-4.14J.01 | Feb 2019 |
Item 11.2-948E Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Ball Grid Array Package (BGA) |
DR-4.27F.01 | Nov 2018 |
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s): JC-11.2 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family |
MO-336A | Nov 2018 |
Item 11-11.963, Access STP File for MO-336A Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Single Sided Hardware 7 Wire 1.2 mm Pitch Package. P-PSXH-W7_I120 |
MO-334A | Sep 2018 |
Item No. 11.14-190 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2. |
DO-221B | Aug 2018 |
Item 11.10-455. Free download. Registration or login required. |
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Standard Practices and Procedures - Package Variation Designators |
SPP-025C | Aug 2018 |
Item No. 11.2-951(S) Committee(s): JC-11.2 Free download. Registration or login required. |
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Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35 |
MO-333A | Aug 2018 |
Item 11.11-952 Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA. |
MO-234E | Jun 2018 |
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B. |
MO-331A | Jun 2018 |
Item 11.11-960 Committee(s): JC-11.11 Free download. Registration or login required. |
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REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA |
MO-330A | Jun 2018 |
Item 11.11-955 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA |
MO-317C | Jan 2018 |
Item 11.11-949 Committee(s): JC-11.11 Free download. Registration or login required. |
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Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge |
GS-010C | Nov 2017 |
Item 11.14-185 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA |
MO-323A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA |
MO-322A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA |
MO-321A.01 | Mar 2017 |
Item No. 11-941(E) Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Flange Mounted Family, Surface Mount, Peripheral Terminals. R-PSFM-G. |
TO-252F | Feb 2017 |
Item 11.10-456 Committee(s): JC-11.10 Free download. Registration or login required. |
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Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA. |
MS-034G | Jan 2017 |
Item No. 11.11-933 (S) Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Registration - Ball Grid Array Family, Square, 1.00 mm Pitch. PBGA |
MO-318B | Jan 2017 |
Item 11.11-934 Outline Cross Reference: Design Registration 4.14 (DR4.14) Patents(): May apply: National – 4688152, 4778641, 4868349. Citizen – 4822550, 4935581 Free download. Registration or login required. |
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Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON). |
DG-4.20F | Sep 2016 |
Item 11.2-820(S) Free download. Registration or login required. |
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Registration - 9 Lead Surface Mount Power Package, 1.2 mm Pitch. H-PSOF |
MO-327A | Sep 2016 |
Item No. 11-925 Committee(s): JC-11.11 Free download. Registration or login required. |
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Design Requirements - Fine-Pitch, Land Grid Array Package, Square and Rectangular (FLGA, FRLGA) |
DG-4.25B | Aug 2016 |
This Design Requirement defines the symbols, definitions, algorithms, and specified dimensions and tolerances for Fine-pitch, LGA packages. The guidelines defined are based on hard metric dimensions and adhere to the geometric dimensioning and tolerancing principles defined in ASME Y14.5M-1994. Item 11.2-896(S) Free download. Registration or login required. |
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Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN) |
DG-4.24B | Aug 2016 |
Item 11.2-850(S) Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, SQUARE, 0.40 mm Top, 0.40 mm Bottom Pitch. S-XBGA. |
MO-302C | Aug 2016 |
Item No.11-930 Patents(): Amkor: 7,185,426; ASAT: 7,372,151; Texas Instruments: 7,675,152, 7,944034; Micron: 7,671,459 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.80 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-326A | Aug 2016 |
Item No. 11-928 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.65 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-325A | Aug 2016 |
Item No. 11-927 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Lower PoP Ball Grid Array Family, Square, 0.50 mm Top, 0.50 mm Bottom Pitch. S-XBGA |
MO-324A | Aug 2016 |
Item No. 11-926 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - 12 Pin UFS Socket Outline, 0.91 mm Pitch. SKT |
SO-022A | Aug 2016 |
Item No. 14-182 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 288 PIN DDR4 MINI DIMM, 0.50 MM PITCH |
MO-314A.02 | Jul 2016 |
Item 14-183, Minor Editorial Revision Committee(s): JC-11.14 Free download. Registration or login required. |
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DDR4 260 Pin SODIMM Connector Performance Standard |
PS-003A.01 | Jul 2016 |
This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E Patents(): FOXCONN US PATENT NO.: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - DDR4 DIMM PTH 288 Pin Socket Outline, 0.85 mm Pitch. SKT |
SO-016C.01 | Apr 2016 |
Item No. 14-181(E) Free download. Registration or login required. |
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Registration - DDR4 DIMM SMT, 288 Pin Socket Outline, 0.85 mm Pitch. SKT |
SO-017C.01 | Apr 2016 |
Item No. 14-181(E) Free download. Registration or login required. |
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REGISTRATION - DDR4 DIMM Press Fit 288 Pin Socket Outline, 0.85 mm Pitch. SKT |
SO-019C.01 | Apr 2016 |
Item 14-181(E) Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 6 Lead Surface Mount Power Package with Fused Leads. H-PSOF |
MO-319A | Feb 2016 |
Item No. 11-912 Patents(): Infineon Technologies AG: 2011012439 A1 (US), 10 2010 060 801 A1 (DE) Committee(s): JC-11.11 Free download. Registration or login required. |
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Design Requirements - Micropillar Grid Array (MPGA) |
DR-4.26B | Nov 2015 |
Item 11.2-845(R) Free download. Registration or login required. |
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Registration - DDR4 Small Outline Dual Inline Memory Module (SODIMM), 260 pin, 0.50 mm pitch Socket Outline |
SO-018D | Oct 2015 |
Item No. 14-180 Patents(): Foxconn: 5,882,211; 6,126,472; 6,113,398 Free download. Registration or login required. |
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Performance Standard - DDR4 288 Pin U/R/LR DIMM Connector Performance Standard |
PS-002A | Jul 2015 |
This standard defines the form, fit and function of DDR4 connectors for U/R/LR modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.40 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR4 connectors in client and server platforms. Committee(s): JC-11.14 Free download. Registration or login required. |
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Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM |
MO-309F | Mar 2015 |
Item No. 11.14-176 Free download. Registration or login required. |