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Title	Document #	Date
Registration - Flange-Mounted Header Family, Straight Leads, Similar to TO-220. Item 11.10-288	TO-262-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variations AA-AD.	DO-200-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB.	MO-024-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.	MO-060-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Single Flange-Mounted Header, 5-Lead. Item 11.10-259.	MO-093-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.	MO-126-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344.	MO-168-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S	MS-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header Family, .200 Pin Spacing. Variations AA-AC. Ref. TO-66, TO-123, TO-124	TO-213-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).	MO-163-B
Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Ceramic Button Rectifier, No Leads, 3 Variations. Item 11.10-362.	DO-217-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278.	MO-034-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.	MO-072-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281.	MO-106-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.	MO-140-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.	MO-179-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.	MS-002-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family, Rectangular Base. Variation AA-AB. Item 11.2-105.	TO-244-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Flange-Mounted Header Family, Straight Leads, Similar to TO-220. Item 11.10-288

Registration - Disc Type Family. Variations AA-AD.

Registration - Dual-In-Line (DIP) Family, 12.70 mm Row Spacing, Variations AA-AB.

Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.

Registration - Plastic Single Flange-Mounted Header, 5-Lead. Item 11.10-259.

Registration - Leadless Small Outline Ceramic Chip Carrier, .400 inch Body, .050 inch Pitch. 28, 32, 26 Leads. Variations AA-AC. Item 11.10-318.

Registration - Plastic Isolated Flange-Mounted Header Family. Variations AA-AB. Item 11.10-344.

Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S

Registration - Flange-Mounted Header Family, .200 Pin Spacing. Variations AA-AC. Ref. TO-66, TO-123, TO-124

Replaced - See MS-028-A. Item 11.11-482S. (Plastic BGA 1.27 mm Pitch).

Registration - Ceramic Button Rectifier, No Leads, 3 Variations. Item 11.10-362.

Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item 11.11-278.

Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.

Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pins). Item 11.10-281.

Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.

Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.

Standard - .050 inch Leadless Chip Carrier, Type A. Variations AA-AH.

Registration - Flange-Mounted Family, Rectangular Base. Variation AA-AB. Item 11.2-105.

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