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Title	Document #	Date
Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly	MO-347A	Mar 2021
Designator: PBMA-N32[39]_Ip0-R14p1x18p1Z1p65-R0p71x1p1 Item: 11.11-987, Access STP Files for MO-347A Cross Reference: N/A Patents(): Kioxia: 1705380 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-193G	Feb 2021
Designator: PDSO-G#_I0P##-##... Item 11.11-990 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package	MO-216G	Jan 2021
Designator: PBGA-B#[#]_I80... Item: 11.11-989, Access STP File for MO-216G Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package	TO-220L.01	Nov 2020
Item 11.10-456(E) Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package	MO-346A	Nov 2020
Designator: PQFP-B#[#]_I0p65... Item: 11.11-981, Access STP Files for MO-346A Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family	MS-013G	Oct 2020
Designator: PDSO-G#-I1p27... Item 11.11-967(S). Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick	MO-345A	Oct 2020
Designator: PDSO-G#_I0P5-##... Item: 11.11-984, Access STP Files for MO-345A Cross Reference: SO-023, GS-010C Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package	MS-012G.02	Sep 2020
Designator: PDSO-G#_I127-##... Item 11.11-972(E), Minor editorial correction. Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 12 Pin UFS Card, 0.91 mm Pitch	MO-320B	Sep 2020
Designator: PBMA-N11-I0p91-CturZ1p0 Item 11.11-985 Patents(): Samsung: US D727910, US D736212, US D736215, US D736214, US D736213, US 29/546125, US 29/546150 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick	MO-178D	Sep 2020
Item 11.10-458 Committee(s): JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE	SO-023C	Sep 2020
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Item: 11.14-202, Access STP Files for SO-023C Cross Reference: MO-329, GS-010C Patents(): CN 202759077 U Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package	MO-344A	Aug 2020
Designator: PBGA-B#[#]_I0p40... Item: 11.11-976, Access STP File for MO-344A Cross Reference: DR4.18 Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
UFS Card Socket Performance Standard	PS-004A	Jul 2020
For UFS Card 6 Gb/sItem 11.14-195S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package	MO-328B	Feb 2020
Designator: PBGA-B#[#]_I0p75... Item: 11.11-979, Access STP File for MO-328B Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package	MO-342A	Jan 2020
Designator: PBGA-B#[#}_I0p65 Item: 11.11-978, Access STP Files for MO-342A Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package	MO-341A	Oct 2019
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1 Item: 11.11-959 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Flatpack 28 Terminal Package	MO-339A	Sep 2019
Item 11-11.975, Access STP File for MO-339A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package	MO-338A	Sep 2019
Item 11.11-973, Access STP Files for MO-338A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package	MO-316B	Apr 2019
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin SODIMM, 0.50 mm Pitch Package	MO-337A	Apr 2019
Item 14-192 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket	SO-024A	Apr 2019
Item 14-193 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.14J.01	Feb 2019
Item 11.2-948E Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)	DR-4.5N.01	Nov 2018
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.27F.01	Nov 2018
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family	MO-336A	Nov 2018
Item 11-11.963, Access STP File for MO-336A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Single Sided Hardware 7 Wire 1.2 mm Pitch Package. P-PSXH-W7_I120	MO-334A	Sep 2018
Item No. 11.14-190 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2.	DO-221B	Aug 2018
Item 11.10-455. Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Package Variation Designators	SPP-025C	Aug 2018
Item No. 11.2-951(S) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35	MO-333A	Aug 2018
Item 11.11-952 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17.	MO-332A	Aug 2018
Item 11.11-958, Access STP File for MO-332A Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA	MO-330A	Jun 2018
Item 11.11-955 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.	MO-234E	Jun 2018
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B.	MO-331A	Jun 2018
Item 11.11-960 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
PART MODEL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS	JEP30	Feb 2018
JEP30 has been superseded and is provided here for reference only. For more information, visit the JEP30 webpage.This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. Committee(s): JC-11.2 Free download. Registration or login required.
Registration - Plastic Thin Shrink Small Outline Package. PDSO-	MO-153G	Jan 2018
Item 11.11-603 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA	MO-317C	Jan 2018
Item 11.11-949 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge	GS-010C	Nov 2017
Item 11.14-185 Committee(s): JC-11, JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA	MO-323A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA	MO-322A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA	MO-321A.01	Mar 2017
Item No. 11-941(E) Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - 39 Pin Removable Memory, 1.00 mm Pitch Microelectronic Assembly

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Registration - Plastic Bottom Grid Array Ball, 0.80 mm Pitch Square Family Package

Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package

Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package

Standard - Plastic Dual Small Outline, 1.27 mm pitch, 7.50 mm Body Width Rectangular Package Family

Registration - Plastic Dual Small Outline Gull Wing Package, 1.10 mm Thick

Standard - Plastic Dual Small Outline (SO) Gull Wing, 1.27 mm Pitch Package

Registration - 12 Pin UFS Card, 0.91 mm Pitch

Registration - Plastic Dual Small Outline Gull Wing Package, 1.45 mm Thick

REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE

REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package

UFS Card Socket Performance Standard

Registration - Plastic Bottom Ball Grid Array, 0.75 mm Pitch Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.65 mm Pitch Square Family Package

Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package

Registration - Plastic Bottom Flatpack 28 Terminal Package

Registration - Plastic Bottom Grid Array Ball, 0.80 MM x 0.70 MM Pitch Rectangular Family Package

Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package

Registration - 262 Pin SODIMM, 0.50 mm Pitch Package

Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket

Design Requirements - Ball Grid Array Package (BGA)

Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)

Design Requirements - Ball Grid Array Package (BGA)

Registration - Plastic Bottom Grid Array, Ball 0.70 mm Pitch, Square Family

Registration - Plastic Single Sided Hardware 7 Wire 1.2 mm Pitch Package. P-PSXH-W7_I120

Registration - Plastic Dual Small Outline, Flat, 2 Terminal Package. PDSO-F2.

Standard Practices and Procedures - Package Variation Designators

Registration - Plastic Bottom Flatpack 35 Terminal Package. PQFP-N35

Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17.

REGISTRATION - Ball Grid Array Family Rectangular, 0.60 mm x 0.70 mm Pitch. PBGA

Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

Registration - Bottom Grid Array Ball, Square, 1.00 mm Pitch. PBGA-B.

PART MODEL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES – XML REQUIREMENTS

Registration - Plastic Thin Shrink Small Outline Package. PDSO-

Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA

Standard - DDR4 DIMM Socket Insertion and Extraction Force Gauge

Registration - Upper PoP Ball Grid Array Family, Square, 0.40 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.65 mm Pitch. PBGA

Registration - Upper PoP Ball Grid Array Family, Square, 0.50 mm Pitch. PBGA

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