Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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DDR5 262 Pin SODIMM Connector Performance Standard |
PS-006B | Sep 2024 |
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 14-226 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 0.95 MM PITCH, RECT PACKAGE (TRANSISTOR) |
TO-236-I | Sep 2024 |
Item #: 11-1067 Package Designator: PDSO-G3(6)-i0p95.... Committee(s): JC-11 Free download. Registration or login required. |
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PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR) |
TO-283A | Sep 2024 |
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE |
MO-216H | Sep 2024 |
Designator: PBGA-B#[#]_I80... Item: 11-1064
Cross Reference: DR4.5 Free download. Registration or login required. |
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PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE |
MO-354B | Sep 2024 |
Item: 11-1065 Designator: PMSO-E#_I1p14-... Free download. Registration or login required. |
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PART MODEL SCHEMAS |
JEP30-10v6-0-0 | Aug 2024 |
This download includes all files under the parent schema JEP30-10v6-0-0 (Committees: JC-11, JC-11.2) including:
This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-A100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE |
MO-153I | Aug 2024 |
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Free download. Registration or login required. |
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PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-364A | Aug 2024 |
Designator:PDFN-N[#]_I1p27... Item #: 11-1063
Free download. Registration or login required. |
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Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-P100E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required. |
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Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-S100A | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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LPDDR5 CAMM2 Connector Performance Standard |
PS-007A | Jul 2024 |
LPDDR5 CAMM2 Connector Performance Standard Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-363A | Jul 2024 |
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE |
MO-359B | Jul 2024 |
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049
Free download. Registration or login required. |
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Descriptive Designation System for Electronic-device Packages and Footprints |
JESD30M | Jul 2024 |
This standard establishes requirements for the generation of electronic-device package designators. Free download. Registration or login required. |
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PLASTIC FLANGE MOUNT, THROUGH-HOLE, 2.54 MM PITCH RECT PACKAGE (TRANSISTOR) |
TO-282A | Jun 2024 |
Package Designator: PMDF-T5_I2p54... Item # 11-1058 Patents(): Owners: - Otremba, Ralf - Kasztelan, Christian - Fuergut, Edward - Lee, Teck Sim - Wang, Lee Shuang - Kuek, Hsieh Ting - Murugan, Sanjay Kumar Company: - Infineon Technologies AG, 85579 Neubiberg, DE Patent Number (Germany): - DE 102015109073 B4 Title: - Free download. Registration or login required. |
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PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT) |
SO-032C | Jun 2024 |
Designator: SO-032B_PDUtBXC-H644_I1p0-R17p15x78p0Z1p05 Patents(): Patent NO: 9,425,525 Free download. Registration or login required. |
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LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY |
MO-357C | Jun 2024 |
Designator: XBMA-H644_I1p0_R78p0x23p0Z2p6 Item #: 14-228 Free download. Registration or login required. |
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DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-358B | Jun 2024 |
Designator: XBNA-N#_I1p0_... Item No: 14-229 Free download. Registration or login required. |
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288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-329H.01 | Jun 2024 |
Designator: PDMA-N288-I0p85-R133p8x#p#7Z31p8R2p55x0p6 Item: 11.14-224, Access Cross Reference: MO-329, SO-023, GS-010
Patents(): Micron: US7,547,213. Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, RECTANGULAR PACKAGE |
MO-203D | May 2024 |
Item 11-1051 Package Designator: PDSO-G#_... Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-360A | May 2024 |
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Free download. Registration or login required. |
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PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE |
MO-339B | May 2024 |
Item 11-1054 Package Designator: PQFP-N28_I4p0... Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-215E | May 2024 |
Package Designator: P-PDSO-G2... Committee(s): JC-11, JC-11.1, JC-11.10 Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR LPDDR5 CAMM2 MODULE |
CO-041A | Apr 2024 |
Item #11.5-1057 Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR CAMM2 CONNECTOR |
CO-040B | Apr 2024 |
Designator: N/A Item #: 11.5-1041 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-219D | Apr 2024 |
Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-361A | Apr 2024 |
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR DDR5 SODIMM MICROELECTRONIC ASSEMBLY |
CO-037A | Jan 2024 |
Designator: N/A Item #: 11.5-995
Free download. Registration or login required. |
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Registration - Plastic Multi Small Outline, 17 Terminal, 1.20 mm Pitch Package. PMSO-E17. |
MO-332B | Jan 2024 |
Package Designator: PMSO-E17_I1p2... Item 11.11-1046, Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, SURFACE TERMINAL, WETTABLE FLANK PACKAGE |
MO-340D | Dec 2023 |
Designator: PDSO_N#[#]_I#-R#x#Z#-CturET0p04
Item: 11-1044 Cross Reference: DR4.8, DR4.16, DR4.20 Patents(): Nexperia BV: 8809121B2 Committee(s): JC-11.11 Free download. Registration or login required. |
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Design Requirements - BALL GRID ARRAY PACKAGE BALL PITCH ≤ 0.80 MM BODY SIZES ≤ 21 MM |
DR-4.5O | Nov 2023 |
BALL GRID ARRAY PACKAGE Item 2-1038 Committee(s): JC-11.2 Free download. Registration or login required. |
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Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family |
MO-276U | Aug 2023 |
Designator: PBGA-B#[#]I0p5...
Item JC11.11-1036 Cross Reference: DR4.5 Committee(s): JC-11.11 Free download. Registration or login required. |
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REGISTRATION - Upper PoP, Plastic Bottom Grid Array Ball, 0.40 mm Pitch Rectangular Family Package |
MO-344B | Aug 2023 |
Designator: PBGA-B#[#]_I0p40... Cross Reference: DR4.18 Committee(s): JC-11 Free download. Registration or login required. |
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PLASTIC QUAD FLATPACK 1.27 MM PITCH, 5.00 MM X 6.00 MM RECTANGULAR FAMILY PACKAGE |
MO-356A | Aug 2023 |
Designator: PQFP-B#[#]_Ip27... Item #: 11-1037 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack, 8 Terminal, 1.27 mm Pitch Package |
MO-341B | Aug 2023 |
Designator: PQFP-F8[10]_I127-R5p51x6.54Z1P1
Item: 11-1030 Committee(s): JC-11.11 Free download. Registration or login required. |
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Registration - Plastic Quad Flatpack, 0.65 mm Pitch, 3.30 mm Body, Square Family Package |
MO-346A.01 | Jun 2023 |
Designator: PQFP-B#[#]_I0p65... Item: 11-981E, Access STP Files for MO-346A Cross Reference: N/A Committee(s): JC-11.11 Free download. Registration or login required. |