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Title	Document #	Date
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.	CO-022-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.	MO-038-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.	MO-073-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.	MO-107-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).	MO-143-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.	MO-182-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.	MS-006-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.	SPP-006
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header Family, Peripheral Terminals. Item 11.10-229	TO-254-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S	CS-001-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA.	MO-018-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).	MO-052-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270	MO-085-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SO) Package Family With .300 inch Body Width. Item 11.11-298.	MO-119-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic CGA Rectangular. Item 11.10-371.	MO-159-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.	MO-198-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.	MS-018-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registrtaion - Hermetic Flange-Mounted Header Family, Peripheral Terminals, 3 Lead, 5.0 Spacing. R-MSFM-X3. Item 11.10-349.	TO-267-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Stud-Hex Base Family, Flexible Terminals. Item 11.10-231.	DO-205-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027.	MO-028-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.	MO-064-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260.	MO-096-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.	MO-129-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.	MO-172-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.	MS-028-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S.	TS-005-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See CS-007-A	CO-024-A
Committee(s): JC-11 JEP95 Registrations Main Page
Registration - TapePak´ Plug Family, Coinstack Magazine. Variation AA-AC. Item 11.5-300.	CO-023-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.	MO-039-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.	MO-075-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.	MO-109-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.	MO-145-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.	MO-183-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.	MS-005-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Revision to 4 Lead Small Outline Transistor (SOT). Item 11.10-380	TO-253-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Use of -PROPOSED- on Ballots.	SPP-007
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.	MO-017-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.	MO-054-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.	MO-086-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Small Outline (SO) Package Family With .350 inch Body Width. Item 11.11-300.	MO-120-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.

Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.

Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).

Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.

Standard - .050 inch Center Leaded Chip Carrier, 24 Terminal Leaded, Type A.

Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion.

Registration - Flange-Mounted Header Family, Peripheral Terminals. Item 11.10-229

Standard - Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads. Variations AA-AC. Replaces CO-017. Item 11.5-428S

Registration - Flatpack Family, 10.16 mm Width, .89 Pitch. Variation AA.

Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).

Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270

Registration - Plastic Small Outline (SO) Package Family With .300 inch Body Width. Item 11.11-298.

Registration - Ceramic CGA Rectangular. Item 11.10-371.

Registration - 3-Tier Family. PQFP-B. Item 11.11-473.

Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.

Registrtaion - Hermetic Flange-Mounted Header Family, Peripheral Terminals, 3 Lead, 5.0 Spacing. R-MSFM-X3. Item 11.10-349.

Registration - Stud-Hex Base Family, Flexible Terminals. Item 11.10-231.

Registration - Dual-In-Line (DIP) Family, 5.08 mm Row Spacing. 10 Pin. Item 11.3-027.

Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.

Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260.

Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.

Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.

Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.

Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S.

Replaced - See CS-007-A

Registration - TapePak´ Plug Family, Coinstack Magazine. Variation AA-AC. Item 11.5-300.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.

Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.

Registration - TapePak´ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.

Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.

Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.

Standard - .050inch Center Leadless Chip Carrier, Type D. Variations DA-DH.

Registration - Revision to 4 Lead Small Outline Transistor (SOT). Item 11.10-380

Standard Practices and Procedures - Use of -PROPOSED- on Ballots.

Registration - Axial Quad Family 2.54 mm Pitch. Variation AA-AC.

Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.

Registration - Low Profile Plastic Quad Flatpack Family .025 Lead Spacing (Gullwing). Item 11.11-267.

Registration - Plastic Small Outline (SO) Package Family With .350 inch Body Width. Item 11.11-300.

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