Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Design Requirements - Metric Small Outline J-Leaded Package Design Guide |
DG-4.13 | Aug 1996 |
Free download. Registration or login required. |
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Design Requirements - Micropillar Grid Array (MPGA) |
DR-4.26B | Nov 2015 |
Item 11.2-845(R) Free download. Registration or login required. |
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Design Requirements - Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (with Optional Thermal Enhancements). QFP-N/SO-N. |
DG-4.8C | Sep 2006 |
Item 11.2-713(s) Free download. Registration or login required. |
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Design Requirements - Plastic Ultra-Thin Small outline No-Lead Package. R-PDSO-N/USON. |
DG-4.16A | Feb 1998 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN. |
DG-4.23A | Nov 2005 |
Item 11.2-728(S) Free download. Registration or login required. |
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Design Requirements - Quad Flatpack |
DG-4.4A | Jun 2000 |
Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN. |
DG-4.19D | May 2007 |
Item 11.2-765(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Scalable Quad Flat No-lead Packages, Square and Rectangular (Scalable QFN) |
DG-4.24B | Aug 2016 |
Item 11.2-850(S) Committee(s): JC-11 Free download. Registration or login required. |
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Design Requirements - Small Scale Plastic Quad and Dual Inline, Square and Rectangular, No-Lead Packages (With Optional Thermal Enhancements). Small Scale (QFN/SON). |
DG-4.20F | Sep 2016 |
Item 11.2-820(S) Free download. Registration or login required. |
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Design Requirements - Thin Small Outline Package, TSOP - Type 2. |
DG-4.15B | May 2004 |
Item 11.2-675(s) Committee(s): JC-11.2 Free download. Registration or login required. |
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Design Requirements - Wafer Level Ball Grid Arrays (WLBGA). |
DR-4.18A.01 | Apr 2021 |
Item 11.2-965(E) Free download. Registration or login required. |
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DESIGN REQUIRMENTS FOR OUTLINES OF SOLID STATE AND RELATED PRODUCTS: DISCONTINUED AS A SEPARATE ITEM. NOW CONTAINED IN JEP95, BOOK 1, SECTION 4.Status: Incorporated |
JESD95-1 | Jan 2000 |
Committee(s): JC-11 |
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JEDEC REGISTERED AND STANDARD OUTLINES FOR SOLID STATE AND RELATED PRODUCTS: |
JEP95 | Jan 2000 |
This publication is a compilation of some 1800 pages of outline drawings for microelectronic packages including transistors, diodes, DIPS, chip carriers and package interface BGA outlines in both inch and metric versions. Committee(s): JC-11 |
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JEP95 Registrations Main Page |
JEP95 Index | Apr 2001 |
This page will provide a link to the Master Index for JEP95. It also provides a link to 'index by device type' as well as the table of contents for each section within JEP95. For older outlines that have been archived, they can be accessed through this page. Committee(s): JC-11 |
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LPDDR5 CAMM2 Connector Performance Standard |
PS-007A | Jul 2024 |
LPDDR5 CAMM2 Connector Performance Standard Free download. Registration or login required. |
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LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY |
MO-357D | Nov 2024 |
Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6 Item #: 11.14-232 Free download. Registration or login required. |
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Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-A100B.01 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100G | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-P100F | Nov 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Free download. Registration or login required. |