Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR) |
TO-283A | Sep 2024 |
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Free download. Registration or login required. |
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PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE |
MO-354B | Sep 2024 |
Item: 11-1065 Designator: PMSO-E#_I1p14-... Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE |
MO-216H | Sep 2024 |
Designator: PBGA-B#[#]_I80... Item: 11-1064
Cross Reference: DR4.5 Free download. Registration or login required. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE |
MO-153I | Aug 2024 |
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Free download. Registration or login required. |
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PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-364A | Aug 2024 |
Designator:PDFN-N[#]_I1p27... Item #: 11-1063
Free download. Registration or login required. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required. |
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LPDDR5 CAMM2 Connector Performance Standard |
PS-007A | Jul 2024 |
LPDDR5 CAMM2 Connector Performance Standard Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-363A | Jul 2024 |
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE |
MO-359B | Jul 2024 |
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049
Free download. Registration or login required. |
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PLASTIC FLANGE MOUNT, THROUGH-HOLE, 2.54 MM PITCH RECT PACKAGE (TRANSISTOR) |
TO-282A | Jun 2024 |
Package Designator: PMDF-T5_I2p54... Item # 11-1058 Patents(): Owners: - Otremba, Ralf - Kasztelan, Christian - Fuergut, Edward - Lee, Teck Sim - Wang, Lee Shuang - Kuek, Hsieh Ting - Murugan, Sanjay Kumar Company: - Infineon Technologies AG, 85579 Neubiberg, DE Patent Number (Germany): - DE 102015109073 B4 Title: - Free download. Registration or login required. |
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DDR5 CAMM2, 1.00 MM X 1.38 MM PITCH, MICROELECTRONIC ASSEMBLY |
MO-358B | Jun 2024 |
Designator: XBNA-N#_I1p0_... Item No: 14-229 Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.50 MM X 0.70 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-360A | May 2024 |
Item #11-1048A Package Designator: PBGA-B#[#] I0p5... Free download. Registration or login required. |
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PLASTIC QUAD FLATPACK, 28 TERMINAL PACKAGE |
MO-339B | May 2024 |
Item 11-1054 Package Designator: PQFP-N28_I4p0... Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-215E | May 2024 |
Package Designator: P-PDSO-G2... Committee(s): JC-11, JC-11.1, JC-11.10 Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR LPDDR5 CAMM2 MODULE |
CO-041A | Apr 2024 |
Item #11.5-1057 Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR CAMM2 CONNECTOR |
CO-040B | Apr 2024 |
Designator: N/A Item #: 11.5-1041 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, FLAT LEAD, 2 TERMINAL, RECTANGULAR PACKAGE (DIODE) |
DO-219D | Apr 2024 |
Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.0675 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-361A | Apr 2024 |
Designator: PBGA--B264[294]_I0p60-R8p7X14p4Z1p0-C0p3Z# Item: 11-1050 Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR DDR5 SODIMM MICROELECTRONIC ASSEMBLY |
CO-037A | Jan 2024 |
Designator: N/A Item #: 11.5-995
Free download. Registration or login required. |