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Title	Document #	Date
Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly	CO-039A	Apr 2023
Designator: N/A Item: 11.5-1004, Access STP File for CO-039A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly	CO-038A	Apr 2023
Designator: N/A Item: 11.5-1001, Access STP File for CO-038A Cross Reference: N/A Committee(s): JC-11.5 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch	MO-355A	Apr 2023
Designator: PQFP-E#_I0p65-R... Item: 11.11-1028, Access STP File for MO-355A Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210R	Mar 2023
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210R Cross Reference: DG4.5 https://www.jedec.org/filebrowser/download/1625 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package	MO-352A.01	Mar 2023
Designator: PBGA-B#[#}_I0p4... Item: 11.11-1006E (Minor editorial Change), Access STP File for MO-352A.01 Cross Reference: N/A Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Part Model Package Guidelines for Electronic-Device Packages – XML Requirements	JEP30-P100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements	JEP30-T100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required.
Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements	JEP30-S100	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
PART MODEL SCHEMAS	JEP30-10v2-0-0	Mar 2023
This download includes all files under the parent schema JEP30-10v2-0-0 (Committees: JC-11, JC-11.2) including: JEP30-A101v2-0-0 (Assembly Process), Committees: JC-11, JC-11.2, JC-14 JEP30-E101v2-0-0 (Electrical), Committees: JC-11, JC-11.2, JC-16 JEP30-P101v2-0-0 (Package), Committees: JC-11, JC-11.2 JEP30-S101v1-0-0 (Supply Chain), Committees: JC-11, JC-11.2, JC-14 JEP30-T101v2-0-0 (Thermal) Committees: JC-11, JC-11.2, JC-15 JEP30-D10v2-0-0 (Types Dictionary) Committees: JC-11, JC-11.2 This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required.
Part Model Guidelines for Electronic-Device Packages – XML Requirements	JEP30A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2 Free download. Registration or login required.
Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements	JEP30-A100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required.
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements	JEP30-E100A	Mar 2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-16 Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family	MO-276T	Jan 2023
Designator: PBGA-B#[#]I0p5...Item 11-1027Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES	JESD30J	Nov 2022
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-1002. NOTE IF YOU DOWNLOADED THIS DOCUMENT PRIOR TO 12/16/2022 PLEASE DISCARD AND VIEW AGAIN, PREVIOUS VERSION CONTAINED FORMAT ISSUES. Committee(s): JC-11.2 Free download. Registration or login required.
STANDARD - DDR5 262 Pin SODIMM Connector Performance Standard	PS-006A	Oct 2022
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 11.14-214S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5	PS-005B	Oct 2022
This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package	MO-311F	Oct 2022
Designator: PBGA-B#[#]_I0p65... Item: 11.11-1026, Access STP File for MO-311E Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket	SO-031A	Aug 2022
Item 11.14-209ADesignator: PMXC-G32[39]_1p0-R19p35x21p0Z3p2-N23p4T# Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package	MO-353A	Aug 2022
Item 11-993Designator: PBGA-B#[#]_I0p73... Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package	MO-349A.01	Aug 2022
Item: 11.4-996EDesignator: SBGA-M7775[23828]_D0p073... Item: 11.4-996Access STP Files for MO-349ACross Reference: DR4.26 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly

Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly

Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch

Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package

Registration - Plastic Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements

PART MODEL SCHEMAS

Part Model Guidelines for Electronic-Device Packages – XML Requirements

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family

DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES

STANDARD - DDR5 262 Pin SODIMM Connector Performance Standard

STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5

Registration - Plastic Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package

Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket

Registration - Plastic Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package

Registration - Silicon Bottom Grid Array Column, 0.048 mm x 0.055 mm Pitch Square Package

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