Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Press Fit Case Family, Single-End, Flanged, Axial Lead. Ref. DO-21. |
DO-208-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Quad-In-Line (QUIP) Family, 5.08/10.16 mm Row Spacing. Variations AA-AB. Item 11.3-032/033. |
MO-031-D | |
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Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122. |
MO-066-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280. |
MO-098-A | |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290. |
MO-131-A | |
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Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412. |
MO-175-A | |
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Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393 |
MO-218-A | |
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Standard - Ceramic Dual-In-Line (CDIP) Family, .300 inch Row Spacing. Item 11.10-374S. |
MS-030-A | |
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Registration - Metric Super Format Tape Automated Bonding (TAB) Package Family. |
UO-018-B | |
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Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .200 inch Width, .050 inch Pitch. Variations AJ-AK. Item 11.10-390). |
MO-003-C | |
Committee(s): JC-11 |
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Registration - Thin Tray for MQFP Packages (Removal of 5 Variations). Item 11.5-445. |
CO-027-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79. |
MO-002-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
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Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400. |
MO-077-D | |
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Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. |
MO-111-A | |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
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Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022. |
MO-185-A | |
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Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH. |
MS-007-A | |
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Registration - Revision - Flange Mounted Header Family (Peripheral Terminals). Item 11.10-361. |
TO-257-C | |
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Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC. |
MO-021-C | |
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