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Title	Document #	Date
Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.	MO-006-D
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.	MO-046-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.	MO-082-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.	MO-116-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.	MO-154-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.	MS-014-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Header Family, 3 Lead, Peripheral Leaded Package. Item 11.10-.	TO-264-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Disc Type Family. Variation AE. Item 118.	DO-200-E
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle.	MO-025-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See MS-027-A. Item 11.11-404S.	MO-061-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.	MO-092-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.	MO-128-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.	MO-167-C
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Coaxial package Outline. Item 269G.	TO-215-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.	TS-001-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Replaced - See CS-001. (Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads). Item 11.5-297	CO-017-B
Committee(s): JC-11 JEP95 Registrations Main Page
Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.	GS-001
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.	MO-037-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.	MO-071-B
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.	MO-105-A
Committee(s): JC-11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Registration - Header Family, 5.842 mm Pin Circle. Variations AE-AH. Ref. TO-101.

Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.

Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.

Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.

Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 80 and 96 Pin Variations. Item 11.11-459.

Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

Registration - Flange-Mounted Header Family, 3 Lead, Peripheral Leaded Package. Item 11.10-.

Registration - Disc Type Family. Variation AE. Item 118.

Registration - Flange-Mounted Family, Axial Lead, 12.70 Pin Circle.

Replaced - See MS-027-A. Item 11.11-404S.

Registration - 6.35 mm Width Ceramic Flatpack (CERPAKS). Item 11.10-270.

Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.

Registration - 128 Pin Dual-In-Line memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-029.

Registration - Coaxial package Outline. Item 269G.

Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.

Replaced - See CS-001. (Metric Tape Automated Bonding (TAB) Magazine Family, 50, 100 Leads). Item 11.5-297

Registration - Dual-In-Line Gauge, 4 Lead, Axial Type.

Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.

Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.

Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.

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