Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Standard Practices and Procedures - Inactivation and Rescission. |
SPP-016 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Gullwing Lead Dimensioning. |
SPP-008 | Sep 1991 |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Grid Array Terminal Position Numbering |
SPP-010B | May 2014 |
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Free download. Registration or login required. |
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Standard Practices and Procedures - Document Procedure. |
SPP-001 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Definition of DAMBAR Protrusion and Intrusion. |
SPP-006 | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard Practices and Procedures - Change Record Methodology |
SPP-021A | Jan 2006 |
Item 11.2-710S Committee(s): JC-11 Free download. Registration or login required. |
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Standard - TSOP-I, Thin Matrix Tray for Shipping and Handling. Item 11.4-437S. |
CS-008-A | Mar 1996 |
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Free download. Registration or login required. |
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Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519. |
CS-005-B | Nov 1998 |
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Free download. Registration or login required. |
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Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S |
MS-025-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Thin Small Outline Package. TSOPII Package. This revision modifies leadframe thickness for 10.16 mm body SOIC family. Item 11.11-753(S) |
MS-024H | Jun 2006 |
Committee(s): JC-11.11 Free download. Registration or login required. |
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