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Title	Document #	Date
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
ACCEPTED PRACTICES FOR MAKING MICROELECTRONIC DEVICE THERMAL CHARACTERISTICS TESTS Status: Rescinded	JEB20	Jan 1975
Committee(s): JC-11
ANNUAL UPDATING SERVICE:	JEP95 AUS	Jan 2000
Subscription to this updating service is available from the JEDEC Office. New outlines are shipped to subscribers for insertion into the appropriate sections of Publication No. 95. JEP95 and Updating Service can be ordered through JEDEC at (703)907-7540 or ptanner@jedec.org. Committee(s): JC-11
DDR4 260 Pin SODIMM Connector Performance Standard	PS-003A.01	Jul 2016
This standard defines the form, fit and function of SODIMM DDR4 connectors for modules supporting channels with transfer rates as high as 3.2 GT/S. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR4 connectors in client and server platforms. Item 11.14-179E Patents(): FOXCONN US PATENT NO.: 5,882,211; 6,126,472; 6,113,398 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES	JESD30J	Nov 2022
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-1002. NOTE IF YOU DOWNLOADED THIS DOCUMENT PRIOR TO 12/16/2022 PLEASE DISCARD AND VIEW AGAIN, PREVIOUS VERSION CONTAINED FORMAT ISSUES. Committee(s): JC-11.2 Free download. Registration or login required.
Design Requirements - Ball Grid Array (BGA)Package Measuring and Methodology.	DG-4.17C	Jul 2008
Item 11.2-791(S) Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.27F.01	Nov 2018
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.14J.01	Feb 2019
Item 11.2-948E Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)	DR-4.5N.01	Nov 2018
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.	DG-4.7F	Jan 2014
Item 11.2-829R Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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