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SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE (HBM4)

 MO-362B Apr 2025

Designator: SBGA-M8236[56028]_I0p65-R14p175x10p975Z0p81

Item #: 4-1079

 

Committee(s): JC-11

JEP95 Registrations Main Page

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SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM

 CO-042A Feb 2025

Designator: N/A

Item #: 5-1074

Committee(s): JC-11, JC-11.5

JEP95 Registrations Main Page

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288 TERMINAL POSITIONS (287 TERMINALS) DDR5 DIMM SMT 0.85MM PITCH SOCKET

 SO-023E Feb 2025

Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2

Item: 11.14-233, Access STP Files for SO-023C

Cross Reference: MO-329, GS-010C

 

Patents(): CN 202759077 U

Committee(s): JC-11, JC-11.14

JEP95 Registrations Main Page

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DESIGN GUIDE 4.10, GENERIC SHIPPING & HANDLING MATRIX TRAY

 DG-4.10E Feb 2025

Item 102-1029S

Committee(s): JC-11, JC-11.2

JEP95 Registrations Main Page

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PART MODEL SCHEMAS

 JEP30-10v8-0-0 Feb 2025

This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-4 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v5-0-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v8-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-1-1 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-4 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-K101v1-0-0 (Design Rule Kits)
     
  • JEP30-M101v1-0-0 (ECAD Models Guidelines)
     
  • JEP30-D10v5-0-0 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-T100B.01 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-15

Free download. Registration or required.

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-P100G Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Guidelines for Electronic-Device Packages – XML Requirements

 JEP30F Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-M100 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-K100 Feb 2025

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

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