Standards & Documents Search

Displaying 1 - 10 of 633 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title Document # Datesort ascending

288 TERM DDR5 DIMM, 0.85 MM PITCH, MICROELECTRONIC ASSEMBLY

 MO-329I Nov 2024

Designator: PDMA-N288-I0p85-R136p8x5p57Z31p8R2p55x0p6

Item: 14-230 

Cross Reference: MO-329, SO-023, GS-010

 

Patents(): Micron: US7,547,213.

Committee(s): JC-11, JC-11.14

JEP95 Registrations Main Page

Free download. Registration or required.

PLASTIC DUAL UPPER TO BOTTOM, 1.38 MM X1.00 MM PITCH CONNECTOR (CMT)

 SO-032D Nov 2024

Designator: SO-032D_PDUtBXC-H736_I1p0-R17p15x78p0Z1p05
Item: 14-231
Cross Reference: N/A

Patents(): Patent NO: 9,425,525

Committee(s): JC-11, JC-11.14

JEP95 Registrations Main Page

Free download. Registration or required.

LPDDR5 CAMM2, 1.38 MM X 1.00 MM PITCH MICROELECTRONIC ASSEMBLY

 MO-357D Nov 2024

Designator: XBMA-H736_I1p0_R78p0x23p0Z2p6

Item #:  11.14-232

Committee(s): JC-11, JC-11.14

JEP95 Registrations Main Page

Free download. Registration or required.

SILICON BOTTOM GRID ARRAY COLUMN, 0.035 MM X 0.055 MM PITCH RECTANGULAR PACKAGE

 MO-362A Nov 2024

Designator: SBGA-M16148[49588]_D0p068...

Item #: 4-1056

 

Committee(s): JC-11

JEP95 Registrations Main Page

Free download. Registration or required.

Descriptive Designation System for Electronic-device Packages and Footprints

JESD30N Nov 2024

This standard establishes requirements for the generation of electronic-device package designators for JEDEC.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Package Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-P100F Nov 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2

Free download. Registration or required.

Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-E100F Nov 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-16

Free download. Registration or required.

PART MODEL SCHEMAS

 JEP30-10v7-0-0 Nov 2024

This download includes all files under the parent schema JEP30-10v7-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-3 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v4-1-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v7-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-1-0 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-3 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-D10v4-0-0 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-S100A.01 Nov 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

DDR5 262 Pin SODIMM Connector Performance Standard

 PS-006B Sep 2024

This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 14-226

Committee(s): JC-11, JC-11.14

JEP95 Registrations Main Page

Free download. Registration or required.

Pages

Search by Keyword or Document Number

or Reset

Filter by keywords: