Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009. |
MO-064-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260. |
MO-096-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298. |
MO-129-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041. |
MO-172-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s. |
MS-028-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S. |
TS-005-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Replaced - See CS-007-A |
CO-024-A | |
Committee(s): JC-11 |
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Registration - TapePak´ Plug Family, Coinstack Magazine. Variation AA-AC. Item 11.5-300. |
CO-023-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing. |
MO-039-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221. |
MO-075-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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