Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # |
Date |
|---|---|---|
Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, TO-79. |
MO-002-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350. |
MO-041-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item 11.11-400. |
MO-077-D | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293. |
MO-111-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319. |
MO-144-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022. |
MO-185-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Standard - .050 inch Center Lead Chip Carrier, Type A. Variations AA-AH. |
MS-007-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Revision - Flange Mounted Header Family (Peripheral Terminals). Item 11.10-361. |
TO-257-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin Tray for MQFP Packages (Removal of 5 Variations). Item 11.5-445. |
CO-027-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Flatpack Family, 15.24 mm Width, 1.27 Pitch. Variations AA-AC. |
MO-021-C | |
Committee(s): JC-11 Free download. Registration or login required. |
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