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Title	Document #	Date
DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES	JESD30I	Aug 2019
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-962. Committee(s): JC-11.2 Free download. Registration or login required.
DDR5 DIMM SMT 288 PIN SOCKET OUTLINE 0.85 MM PITCH SKT	SO-023B	Jul 2019
Item 11.14-196 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Silicon Bottom Grid Array Column, 0.048 x 0.0275 Pitch, Rectangular Family Package	MO-316B	Apr 2019
Package Designator: SBGA-M#(#)_I0p055 Item Number: 11.4-966 Committee(s): JC-11.4 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Plastic Dual Small Outline (SO) Family, Gull Wing, 1.27 mm Pitch Package. PDSO-G.	MS-012G.01	Apr 2019
Item 11.11-972(E). Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin SODIMM, 0.50 mm Pitch Package	MO-337A	Apr 2019
Item 14-192 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - 262 Pin DDR5 SODIMM, 0.50 mm Pitch Socket	SO-024A	Apr 2019
Item 14-193 Committee(s): JC-11.14 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.14J.01	Feb 2019
Item 11.2-948E Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Multi Position Flange Mount Mixed Technology, 0.10 in. Pitch Package	TO-220L	Jan 2019
Item 11.10-457 Committee(s): JC-11, JC-11.10 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)	DR-4.5N.01	Nov 2018
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.27F.01	Nov 2018
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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