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Displaying 1 - 4 of 4 documents.

Title	Document #	Date
Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.	MO-252D	Mar 2010
Item 11.11-830. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.	MO-236C	Mar 2010
Item 11.11-826 Committee(s): JC-11, JC-11.10, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.	MO-248-E	Jun 2006
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.	MO-255-B	Oct 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

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