Global Standards for the Microelectronics Industry
Standards & Documents Search
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Document # | Date |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.Status: Rescinded March 2018 |
MO-273C | Mar 2011 |
The information contained in MO-273, has been moved to 3 different MO's as follows: The 0.40 mm pitch has been moved to MO-317. The 0.50 mm pitch has been moved to MO-321. The 0.65 mm pitch has been moved to MO-322. Item 11.11-941(E) |
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Registration - Very Thin Profile, Fine Pitch, Square Bump Grid Array Family. VF-XBGA. |
MO-294-A | Nov 2008 |
Item 11.11-804 Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA. |
MO-225-C | Aug 2007 |
Item 11.11-761 and 11.11-761(E). Free download. Registration or login required. |