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Displaying 1 - 3 of 3 documents.

Title	Document #	Date
Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.	MO-257-B	May 2005
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.	MO-267-B	Feb 2006
Item 11.11-745 Patents(): Amkor, ASAT, National Semiconductor: See Outline Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Quad No-Lead Staggered and Inline Multi-Row Packages (with optional thermal enhancements). QFN.	DG-4.19D	May 2007
Item 11.2-765(s) Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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