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Displaying 1 - 3 of 3 documents.

Title	Document #	Date
Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.	MO-219-G	Jan 2007
Item 11.11-763 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.	MO-259-A	Mar 2005
Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard Practices and Procedures - Mold Flash, Interlead Flash, Gate Burrs and Protrusion for Plastic Packages. Item 11.2-379.	SPP-014	Jul 1994
Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.

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