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Title	Document #	Date
Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).	DR-4.18A.01	Apr 2021
Item 11.2-965(E) Committee(s): JC-11, JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package	MO-210Q	Jan 2021
Designator: PBGA-B#[#]_I0p... Item: 11.11-988, Access STP Files for MO-210Q Cross Reference: DG4.5 Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package	MO-276P	Jan 2021
Designator: PBGA-B#[#]_I0p5... Item: 11.11-986, Access STP File for MO-276P Cross Reference: DR4.5 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA)	DR-4.14J.01	Feb 2019
Item 11.2-948E Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)	DR-4.5N.01	Nov 2018
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.	MO-234E	Jun 2018
Item 11.11-954 Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.	MS-034G	Jan 2017
Item No. 11.11-933 (S) Item No. 11.11-723(S), Elevated MO-151 to Standard and included and increased Ax dimensions to allow for thicker packages. Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch.	MO-246H	May 2015
Designator: (T,B) FR-XBGA Item: 11.11-906 Committee(s): JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.	DG-4.7F	Jan 2014
Item 11.2-829R Committee(s): JC-11.2 JEP95 Registrations Main Page Free download. Registration or login required.
Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA	MO-304D	Jul 2013
Item 11.11-882 Committee(s): JC-11, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.

Standards & Documents Search

Design Requirements - Wafer Level Ball Grid Arrays (WLBGA).

Registration - Plastic Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package

Registration - Plastic Bottom Grid, Array Ball, 0.50 mm Pitch, Rectangular Family Package

Design Requirements - Ball Grid Array Package (BGA)

Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA)

Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA.

Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch.

Design Requirements - Die-Size Ball Grid Array Packages (DSBGA) Design Guide.

Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA

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