Forgot Password | Site Login
Go to main content
®

Global Standards for the Microelectronics Industry

Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2022 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Presentations for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Activities
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Member List
    • Board of Directors
    • Committee Chairs
    • Policies & Governance
    • Patent Policy
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

Main menu

  • Standards & Documents
    • Search Standards & Documents
    • Recently Published Documents
    • Technology Focus Areas
      • Main Memory: DDR4 & DDR5
      • Mobile Memory: LPDDR, Wide I/O
      • Flash Memory: SSDs, UFS, e.MMC, XFMD
      • Memory Configurations: JESD21-C
      • Memory Module Design File Registrations
      • Wide Bandgap Power Semiconductors: GaN, SiC
      • Registered Outlines: JEP95
      • JEP30: Part Model Guidelines
      • ESD: Electrostatic Discharge
      • Lead-Free Manufacturing
    • Type Registration, Data Sheets
    • Order JEDEC Standard Manufacturer's ID Code
    • Order ID Code for Low Power Memories
    • Copyright Information
    • Document Translation
    • About JEDEC Standards
  • Committees
    • All Committees
    • JC-11: Mechanical Standardization
    • JC-13: Government Liaison
    • JC-14: Quality and Reliability of Solid State Products
    • JC-15: Thermal Characterization Techniques for Semiconductor Packages
    • JC-16: Interface Technology
    • JC-40: Digital Logic
    • JC-42: Solid State Memories
    • JC-45: DRAM Modules
    • JC-63: Multiple Chip Packages
    • JC-64: Embedded Memory Storage & Removable Memory Cards
    • JC-70: Wide Bandgap Power Electronic Conversion Semiconductors
  • News
    • News
    • JEDEC Awards: 2022 Honorees
    • JEDEC Awards: Distinguished Members Recognition
    • In Memoriam
    • JEDEC Quality & Reliability Task Group in China
    • Media Kit
  • Events & Meetings
    • All Events & Meetings
    • JEDEC DDR5 Workshop: Presentations for Sale
  • Join
    • Apply for Membership
    • Membership Benefits
    • Membership Dues & Details
  • About
    • Overview
    • Activities
    • JEDEC History
      • Pre-1960s
      • 1960s
      • 1970s
      • 1980s
      • 1990s
      • 2000s
      • 2010s
    • Member List
    • Board of Directors
    • Committee Chairs
    • Policies & Governance
    • Patent Policy
    • Contact
    • RSS Feeds
    • JEDEC Staff
    • Website Help
    • Year in Review: 2022
  • Login required Members Area

Standards & Documents Search

Displaying 6 - 6 of 6 documents. Show 5 results per page.

Title Document # Datesort ascending

Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

MO-211-C Jun 2004

Committee(s): JC-11.4

JEP95 Registrations Main Page

Free download. Registration or login required.

Pages

  • « first
  • ‹ previous
  • 1
  • 2

Search by Keyword or Document Number

or Reset

Filter by committees:

  • (-) Remove JC-11: Mechanical Standardization filter JC-11: Mechanical Standardization

Filter by document type:

  • MO- (Microelectronic Outlines) (6) Apply MO- (Microelectronic Outlines) filter

Filter by keywords:

  • (-) Remove BGA filter BGA
  • (-) Remove very thin filter very thin
  • 0.40 mm pich (1) Apply 0.40 mm pich filter
  • Ball Grid Array (3) Apply Ball Grid Array filter
  • Bump (1) Apply Bump filter
  • CSP (1) Apply CSP filter
  • Die Size (1) Apply Die Size filter
  • DSBGA (1) Apply DSBGA filter
  • Extremely Thin (1) Apply Extremely Thin filter
  • Fine-Pitch (3) Apply Fine-Pitch filter
  • Fine Pitch (1) Apply Fine Pitch filter
  • Grid Array (1) Apply Grid Array filter
  • Rectangular (1) Apply Rectangular filter
  • Square (2) Apply Square filter
  • Stackable (1) Apply Stackable filter
  • VF-XBGA (3) Apply VF-XBGA filter
  • VFR-XBGA (1) Apply VFR-XBGA filter
  • Terms & Conditions
  • Privacy Policy
  • Contact Us
  • Refund Policy
  • Website Help
  • Login

Copyright © 2023 JEDEC. All Rights Reserved.

User login