Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783 |
SPP-024A | Mar 2009 |
This document states the procedures for using component land side flatness during simulated reflow as an alternative to coplanarity in certain limited cases for BGA components. Free download. Registration or login required. |
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Standard - Ball Grid Array Family, Square, 1.27 mm, and 1.50 mm Pitch. S-PBGA/PBGA. |
MS-034G | Jan 2017 |
Item No. 11.11-933 (S) Patents(): National Semiconductor: 4688152; 4778641; 4868349. Citizen Watch Company: 4822550; 4935581. Free download. Registration or login required. |
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Registration - Very Thin, Fine-Pitch, Stackable Ball Grid, 0.50 mm Ball Pitch Array Family. VF-XBGA.Status: SupersededAugust 2016 MO-266 variations: AA, AB, AC, AD, AE, and AF are now in MO-325 MO-266 variations: BA, BB, BC, BD, BE, and BF are now in MO-324 MO-266 variation: CA is now in MO-326 |
MO-266C | Jan 2009 |
Item 11.11-807 Patents(): Micron: 6,048,758. Tessera: 5,950,304; 6,133,627. Committee(s): JC-11.11 |
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Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA. |
MO-280-A | Sep 2006 |
Item 11-759 Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Thin, Very-Thin, Very-Very-Thin Profile, Fine Pitch Ball Grid Array Family, 0.40mm pitch (Square). (T,V,W)F-XBGA. |
MO-298-A | Jun 2009 |
Item 11.11-816 Free download. Registration or login required. |
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Registration - Thin, Fine-Pitch, Rectangular Dual Pitch Ball Grid Array Family, 0.80 mm x 1.00 mm pitch. TFR-XBGA. |
MO-284-A | May 2007 |
Item 11.11-755 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627 Free download. Registration or login required. |
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Registration - Thin Profile, Interstitial Fine Pitch Ball Grid Array Family, Square. TFI-PBGA. |
MO-295-A | Jan 2009 |
Item 11.11-795 Free download. Registration or login required. |
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Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA. |
MO-261-A | Jun 2005 |
Item 11.11-718 Patents(): Micron: 6,048,753. Tessera: 5,950,304; 6,133,627. Free download. Registration or login required. |
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Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432 |
MO-156-C | Apr 2005 |
Free download. Registration or login required. |
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Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB. |
MO-264-A | Nov 2005 |
Item 11.4-731 Free download. Registration or login required. |