Standards & Documents Search

Displaying 1441 - 1460 of 1463 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
UNIVERSAL FLASH STORAGE, UFS 2.2	JESD220C-2.2	Aug 2020
The purpose of this standard is definition of a UFS Universal Flash Storage electrical interface and a UFS memory device. This standard defines a unique UFS feature set and includes the feature set of eMMC standard as a subset. This standard replaces JESD220C, UFS 2.1, and introduces a feature called WriteBooster. Item 138.88. Committee(s): JC-64.1 Free download. Registration or login required.
UNIVERSAL FLASH STORAGE, Version 4.0 Status: Superseded December 2024 by JESD220G	JESD220F	Aug 2022
NOTE: This document has been superseded by JESD220G published in December 2024, but remains available for reference purposes. Committee(s): JC-64.1 Available for purchase: $369.00 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.
USER GUIDE FOR MICROCIRCUIT FAILURE ANALYSIS: Status: RescindedNovember 2004	JEB16	Jul 1970
This guide defines generalized procedures for the failure analysis of monolithic integrated microelectronic circuits. Although the generalized procedural steps may apply to all microelectronic circuits, additional analysis steps unique to thin/thick film hybrid devices are not covered. Committee(s): JC-14 Free download. Registration or login required.
USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE:	JEP138	Sep 1999
The purpose of these user guidelines is to provide background and an example for the use of an infrared (IR) microscope to determine die temperature of electronic devices for calculations such as thermal resistance. Committee(s): JC-25 Free download. Registration or login required.
USER GUIDELINES FOR QUALITY AND RELIABILITY ASSURANCE OF LSI COMPONENTS Status: RescindedApr-87	JEB17	Jan 1970
VCSDRAM Specific SDRAM Functions	SDRAM3.11.5.4	Jun 1999
Release No. 9 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
VIBRATION, VARIABLE FREQUENCY	JESD22-B103B.01	Sep 2016
The Vibration, Variable Frequency Test Method is intended to determine the ability of component(s) to withstand moderate to severe vibration as a result of motion produced by transportation or filed operation of electrical equipment. This is a destructive test that is intended for component qualification. This is a minor editorial change to JESD22-B103B, June 2002 (Reaffirmed September 2010). Committee(s): JC-14.1 Free download. Registration or login required.
VOLTAGE REGULATOR DIODE NOISE VOLTAGE MEASUREMENT Status: Reaffirmed January 1992, April 1999, April 2002	JESD307	May 1965
This standard is intended to cover the measurement of noise voltage in voltage regulator diodes in the reverse breakdown region. It describes noise voltage measurements at specified conditions, but may be used as a guide for making such measurements at other than specified conditions. Formerly known as RS-307 and/or EIA-307 Committee(s): JC-22.4 Free download. Registration or login required.
WIDE I/O 2 (WideIO2)	JESD229-2	Aug 2014
This standard defines Wide I/O 2 (WideIO2), including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 8 Gb through 32 Gb SDRAM devices with 4 or 8 64-bit wide channels using direct chip-to-chip attach methods for between 1 and 4 memory devices and a controller/buffer device. The WideIO2 architecture is an evolution of the WIO architecture to enable bandwidth scaling with capacity. Committee(s): JC-42.6 Free download. Registration or login required.
WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)	JESD229	Dec 2011
This standard defines the Wide I/O specification, including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. This standard covers the following technologies: Wide I/O. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 1 Gb through 32 Gb SDRAM (monolithic density) devices with 4, 128b wide channels using direct chip-to-chip attach methods between 1 to 4 memory devices and a controller device. Committee(s): JC-42, JC-42.6 Free download. Registration or login required.
Wire Bond Pull Test Methods	JESD22-B120.01	Sep 2024
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
WIRE BOND SHEAR TEST	JESD22-B116B	May 2017
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S) Status: SupersededAugust 2016 (11.2-924)	SPP-020A	Jul 2003
SPP-020 is a duplicate of SPP-010. SPP-010 has multiple solder ball pitch terminal numbering, SPP-020 does not. Since SPP-010 is more up to date than SPP-020 it is being withdrawn. SPP-010 covers both square and rectangular packages, SPP-020 covered only rectangular packages. Committee(s): JC-11.2, JC-11.11 JEP95 Registrations Main Page Free download. Registration or login required.
Word Wide DRAM	DRAM3.9.4	Jul 2000
Release No. 10 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide EPROM	EPROM3.4.2	Jun 1999
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide Graphics DRAM	MPDRAM3.10.3	Jan 2004
Release No.13 Committee(s): JC-42.3, JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide PROM, DIP to SO Conversion	PROM3.3.3-4	Dec 1993
Release No.1 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide ROM	ROM3.2.2	Dec 1992
Release No.6 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide SDRAM.	SDRAM3.11.4	Feb 2008
Release No. 17. Item 1749.01 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.
Word Wide TTL and MOS SRAM	SRAM3.7.7	Apr 2007
Release No. 16. Item 1541.03 Committee(s): JC-42, JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required.

Standards & Documents Search

UNIVERSAL FLASH STORAGE, UFS 2.2

UNIVERSAL FLASH STORAGE, Version 4.0

USER GUIDE FOR MICROCIRCUIT FAILURE ANALYSIS:

USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE:

USER GUIDELINES FOR QUALITY AND RELIABILITY ASSURANCE OF LSI COMPONENTS

VCSDRAM Specific SDRAM Functions

VIBRATION, VARIABLE FREQUENCY

VOLTAGE REGULATOR DIODE NOISE VOLTAGE MEASUREMENT

WIDE I/O 2 (WideIO2)

WIDE I/O SINGLE DATA RATE (WIDE I/O SDR)

Wire Bond Pull Test Methods

WIRE BOND SHEAR TEST

WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)

Word Wide DRAM

Word Wide EPROM

Word Wide Graphics DRAM

Word Wide PROM, DIP to SO Conversion

Word Wide ROM

Word Wide SDRAM.

Word Wide TTL and MOS SRAM

Pages

Search by Keyword or Document Number

Filter by committees:

Filter by document type:

Filter by keywords: