Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 0.95 MM PITCH, RECT PACKAGE (TRANSISTOR) |
TO-236-I | Sep 2024 |
Item #: 11-1067 Package Designator: PDSO-G3(6)-i0p95.... Committee(s): JC-11 Free download. Registration or login required. |
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JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®) |
JESD325 | Sep 2024 |
This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2.0 Specification or later. Free download. Registration or login required. |
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DDR5 SERIAL PRESENCE DETECT (SPD) CONTENTSRelease Number: Release 1.3 |
JESD400-5C | Sep 2024 |
This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be use by the system's BIOS in order to properly initialize and optimize the system memory channels. Committee(s): JC-45 Free download. Registration or login required. |
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Temperature Range and Measurement Standards for Components and Modules |
JESD402-1B | Sep 2024 |
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications. Committee(s): JC-42 Free download. Registration or login required. |
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PLASTIC DUAL FLANGE MOUNT, 2.00 MM PITCH RECT PACKAGE (TRANSISTOR) |
TO-283A | Sep 2024 |
Item #11-1060 Package Designator: PDFM-E5_I2p0.... Free download. Registration or login required. |
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Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing (Wafer Fabrication Manufacturing Sites) |
JEP001-3B | Sep 2024 |
The publication provides methodologies for measurements to qualify a new semiconductor wafer process. Free download. Registration or login required. |
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PLASTIC MULTI SMALL OUTLINE, 1.20 MM PITCH PACKAGE 1.14 MM PITCH, 15.40 MM BODY WIDTH, RECT FAMILY PACKAGE |
MO-354B | Sep 2024 |
Item: 11-1065 Designator: PMSO-E#_I1p14-... Free download. Registration or login required. |
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PLASTIC BOTTOM GRID ARRAY BALL, 0.80 MM PITCH, SQUARE FAMILY PACKAGE |
MO-216H | Sep 2024 |
Designator: PBGA-B#[#]_I80... Item: 11-1064
Cross Reference: DR4.5 Free download. Registration or login required. |
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Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-A100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-14.4 Free download. Registration or login required. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30E | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, RECTANGULAR FAMILY PACKAGE |
MO-153I | Aug 2024 |
Package Designator: PDSO-G#-I##.... Item# - JC11.11-1069 Free download. Registration or login required. |
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SOLID STATE DRIVE (SSD) REQUIREMENTS AND ENDURANCE TEST METHOD |
JESD218B.03 | Aug 2024 |
Terminology Update, see Annex. This standard defines JEDEC requirements for solid state drives. For each defined class of solid state drive, the standard defines the conditions of use and the corresponding endurance verification requirements. Although endurance is to be rated based upon the standard conditions of use for the class, the standard also sets out requirements for possible additional use conditions as agreed to between manufacturer and purchaser. Revision A includes further information on SSD Capacity. Items 303.19, 303.20, 303.21, 303.22, 303.23, 303.26, 303.27, 303.28, and 303.32 Committee(s): JC-64.8 Available for purchase: $76.00 Add to Cart Paying JEDEC Members may login for free access. |
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Guidelines for Reverse Recovery Time and Charge Measurement of SiC MOSFET Version 1.0 |
JEP201 | Aug 2024 |
This guideline is intended to overcome the limitations of prior standards and provide a test circuit and method that provides both reliable and repeatable results. Free download. Registration or login required. |
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PLASTIC DUAL FLATPACK, SURFACE TERMINAL, 1.27 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-364A | Aug 2024 |
Designator:PDFN-N[#]_I1p27... Item #: 11-1063
Free download. Registration or login required. |
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JEDEC Module Sideband Bus (SidebandBus) |
JESD403-1C.01 | Aug 2024 |
This standard defines the assumptions for the system management bus for next generation memory solutions; covering the interface protocol, use of hub devices, and voltages appropriate to these usages. Committee(s): JC-45 Free download. Registration or login required. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100B | Aug 2024 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required. |
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LPDDR5 CAMM2 Connector Performance Standard |
PS-007A | Jul 2024 |
LPDDR5 CAMM2 Connector Performance Standard Free download. Registration or login required. |
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PLASTIC BOTTOM GRID, ARRAY BALL, 0.60 MM X 0.50 MM PITCH RECTANGULAR FAMILY PACKAGE |
MO-363A | Jul 2024 |
Designator: PBGA-B#[#]_I0p5... Item #: 11-1066 Free download. Registration or login required. |
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PLASTIC DUAL SMALL OUTLINE, GULL WING, 2.00 MM PITCH, RECTANGULAR PACKAGE |
MO-359B | Jul 2024 |
Designator: H-PDSO-G12_12p0-12p0x9p4Z2p8 Item No: 11-1049
Free download. Registration or login required. |
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Style Manual for Standards and Other Publications of JEDEC |
JM7A | Jul 2024 |
This manual establishes requirements for the preparation of standards and certain other publications of the JEDEC Solid State Technology Association. Committee(s): JC-10 Free download. Registration or login required. |