Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
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DDR5 Clocked Unbuffered Dual Inline Memory Module with 4-bit ECC (EC4 CUDIMM) Raw Card E AnnexRelease Number: Version 1.00 |
JESD323-B4-RCE | Feb 2025 |
This annex, JESD323-B4-RCE, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 CUDIMM. The common feature of DDR5 CUDIMM such as the connector pinout can be found in the JESD323, DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common StandardRelease Number: Version 1.1 |
JESD323A | Feb 2025 |
This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Clocked, Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CUDIMMs). These DDR5 Clocked Unbuffered DIMMs (CUDIMMs) are intended for use as main memory when installed in Computers. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Common StandardRelease Number: Version 1.1 |
JESD324A | Feb 2025 |
This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Clocked Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM CSODIMMs). These DDR5 CSODIMMs are intended for use as main memory when installed in Computers, laptops and other systems. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card A AnnexRelease Number: Version 2.00 |
JESD305-R8-RCA | Feb 2025 |
This annex, JESD305-R8-RCA, DDR5 Registered Dual Inline Memory Module with 8-bit ECC (EC8 RDIMM) Raw Card A Annex, defines the design detail of x4, 2 Package Rank DDR5 RDIMM with 8-bit ECC. The common feature of DDR5 RDIMM, such as the connector pinout, can be found in the JESD305, DDR5 Registered Dual Inline Memory Module (RDIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card B AnnexRelease Number: Version 1.00 |
JESD323-A0-RCB | Feb 2025 |
This annex, JESD323-A0-RCB, “DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Raw Card B Annex", defines the design detail of x8, 2 Package Ranks DDR5 CUDIMM. The common feature of DDR5 CUDIMM such as the connector pinout can be found in the JESD323, DDR5 Clocked Unbuffered Dual Inline Memory Module (CUDIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Raw Card B AnnexRelease Number: Version 1.00 |
JESD324-V0-RCB | Feb 2025 |
This annex JESD324-V0-RCB, “DDR5 Clocked Small Outline Dual Inline Memory Module with 0-bit ECC (EC0 CSODIMM) Raw Card B Annex" defines the design detail of x8, 2 Package Ranks DDR5 NECC Clocked SODIMM. The common feature of DDR5 CSODIMM such as the connector pinout can be found in the JESD324, DDR5 Clocked Small Outline Dual Inline Memory Module (CSODIMM) Common Standard. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Unbuffered Dual Inline Memory Module (UDIMM) Common StandardRelease Number: Version 1.2 |
JESD308B | Feb 2025 |
This standard defines the electrical and mechanical requirements for 288-pin, 1.1 V (VDD), Unbuffered, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM UDIMMs). These DDR5 Unbuffered DIMMs (UDIMMs) are intended for use as main memory when installed in Computers. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common StandardRelease Number: Version 1.1 |
JESD309A | Feb 2025 |
This standard defines the electrical and mechanical requirements for 262-pin, 1.1 V (VDD), Small Outline, Double Data Rate, Synchronous DRAM Dual In-Line Memory Modules (DDR5 SDRAM SODIMMs). These DDR5 SODIMMs are intended for use as main memory when installed in Computers, laptops and other systems. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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Graphics Double Data Rate 7 SGRAM Standard (GDDR7) |
JESD239B | Feb 2025 |
This standard defines the Graphics Double Data Rate 7 (GDDR7) Synchronous Graphics Random Access Memory (SGRAM) specification, including features, functionality, package, and pin assignments.
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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PMIC5120 Power Management IC StandardRelease Number: Version 1.0 |
JESD301-6 | Feb 2025 |
This standard defines the specification of interface parameters, signaling protocols, and features for PMIC devices used for memory module applications. The designation PMIC5120 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5120 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Unless otherwise noted in the document, any illegal operation is not allowed and device operation is not guaranteed. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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SHIPPING AND HANDLING TRAY FOR DDR5 2U DIMM |
CO-042A | Feb 2025 |
Designator: N/A Item #: 5-1074 A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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STANDARD MANUFACTURER'S IDENTIFICATION CODE |
JEP106BL | Feb 2025 |
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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288 TERMINAL POSITIONS (287 TERMINALS) DDR5 DIMM SMT 0.85MM PITCH SOCKET |
SO-023E | Feb 2025 |
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2 Item: 11.14-233, Access STP Files for SO-023C Cross Reference: MO-329, GS-010C
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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DESIGN GUIDE 4.10, GENERIC SHIPPING & HANDLING MATRIX TRAY |
DG-4.10E | Feb 2025 |
Item 102-1029S A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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PART MODEL SCHEMAS |
JEP30-10v8-0-0 | Feb 2025 |
This download includes all files under the parent schema JEP30-10v8-0-0 (Committees: JC-11, JC-11.2) including:
This will enable the user to validate the schemas. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16 Free download. Registration or login required. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100B.01 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-11, JC-11.2, JC-15 Free download. Registration or login required. |
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Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-P100G | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30F | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-M100 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “generated ECAD model” subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-K100 | Feb 2025 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the “Design Kit” subsection of the Part Model. For more information visit the main JEP30 webpage. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |