Global Standards for the Microelectronics Industry
Standards & Documents Search
Title |
Document # | Date |
|---|---|---|
Registration - 3 Lead Plastic Flange-Mounted Package. Item 11.10-401 |
TO-274-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 2 and 4 Lead Surface Mount Power Package. (H,HB1)-PDSO, (H,HB1)-PSOF. Item 11.10-446. |
TO-270C | Jul 2008 |
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Free download. Registration or login required. |
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Registration - 2, 4, and 6 Lead Screw Mount Power Package. PDFP-(C, F, G). Item 11.10-444. |
TO-272-C | Oct 2007 |
Committee(s): JC-11.11, JC-11.10 Free download. Registration or login required. |
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Registration - 3 Lead Flange-Mounted Ceramic Power Package.R-CSFM-T3. Item 11.10-309. |
TO-265-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 4 Lead Quad Flat Pack (QFP). |
TO-271-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - 4 Lead Small Outline Package (SOP). Item 11.10-358 |
TO-269-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Addition of Variation AB to Flange-Mounted Header Family. Item 11.10-307. |
TO-259-B | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Bottom Terminal Ceramic Chip Carrier Family. Item 11.10-408. |
TO-276-A | Feb 2001 |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Ceramic Header Axial 3-Lead. |
TO-260-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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Registration - Coaxial package Outline. Item 269G. |
TO-215-A | |
Committee(s): JC-11 Free download. Registration or login required. |
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