Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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TS3000 Standalone Thermal Sensor Component |
SPD4.1.5 | Nov 2009 |
Release No. 19A, Item 1640.11 Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TSE2002 Serial Presence Detect with Thermal Sensor |
PRN09-NV2 | Jul 2009 |
Preliminary publication of BoD-approved ballot material, prior to its inclusion in the next release of the appropriate JEDEC Standard. Item 1756.00A Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Two Byte Modules Cards |
MODULE4.3 | Jun 1997 |
Release No.9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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VCSDRAM Specific SDRAM Functions |
SDRAM3.11.5.4 | Jun 1999 |
Release No. 9 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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WIDE I/O 2 (WideIO2) |
JESD229-2 | Aug 2014 |
This standard defines Wide I/O 2 (WideIO2), including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 8 Gb through 32 Gb SDRAM devices with 4 or 8 64-bit wide channels using direct chip-to-chip attach methods for between 1 and 4 memory devices and a controller/buffer device. The WideIO2 architecture is an evolution of the WIO architecture to enable bandwidth scaling with capacity. Committee(s): JC-42.6 Free download. Registration or login required. |