Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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Word Wide TTL and MOS SRAM |
SRAM3.7.7 | Apr 2007 |
Release No. 16. Item 1541.03 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide SDRAM. |
SDRAM3.11.4 | Feb 2008 |
Release No. 17. Item 1749.01 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide ROM |
ROM3.2.2 | Dec 1992 |
Release No.6 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide PROM, DIP to SO Conversion |
PROM3.3.3-4 | Dec 1993 |
Release No.1 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide Graphics DRAM |
MPDRAM3.10.3 | Jan 2004 |
Release No.13 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide EPROM |
EPROM3.4.2 | Jun 1999 |
Release No.9 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Word Wide DRAM |
DRAM3.9.4 | Jul 2000 |
Release No. 10 Committee(s): JC-42 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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WIDE I/O SINGLE DATA RATE (WIDE I/O SDR) |
JESD229 | Dec 2011 |
This standard defines the Wide I/O specification, including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. This standard covers the following technologies: Wide I/O. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 1 Gb through 32 Gb SDRAM (monolithic density) devices with 4, 128b wide channels using direct chip-to-chip attach methods between 1 to 4 memory devices and a controller device. Free download. Registration or login required. |
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WIDE I/O 2 (WideIO2) |
JESD229-2 | Aug 2014 |
This standard defines Wide I/O 2 (WideIO2), including features, functionality, AC and DC characteristics, packages, and micropillar signal assignments. The purpose of this standard is to define the minimum set of requirements for JEDEC compliant, 8 Gb through 32 Gb SDRAM devices with 4 or 8 64-bit wide channels using direct chip-to-chip attach methods for between 1 and 4 memory devices and a controller/buffer device. The WideIO2 architecture is an evolution of the WIO architecture to enable bandwidth scaling with capacity. Committee(s): JC-42.6 Free download. Registration or login required. |
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VCSDRAM Specific SDRAM Functions |
SDRAM3.11.5.4 | Jun 1999 |
Release No. 9 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Two Byte Modules Cards |
MODULE4.3 | Jun 1997 |
Release No.9 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TSE2002 Serial Presence Detect with Thermal Sensor |
PRN09-NV2 | Jul 2009 |
Preliminary publication of BoD-approved ballot material, prior to its inclusion in the next release of the appropriate JEDEC Standard. Item 1756.00A Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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TS3000 Standalone Thermal Sensor Component |
SPD4.1.5 | Nov 2009 |
Release No. 19A, Item 1640.11 Committee(s): JC-42.4 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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SYSTEM LEVEL ROWHAMMER MITIGATION |
JEP301-1 | Mar 2021 |
A DRAM rowhammer security exploit is a serious threat to cloud service providers, data centers, laptops, smart phones, self-driving cars and IoT devices. Hardware research and development will take time. DRAM components, DRAM DIMMs, System-on-chip (SoC), chipsets and system products have their own design cycle time and overall life time. This publication recommends best practices to mitigate the security risks from rowhammer attacks. Item 1866.02. Committee(s): JC-42 Free download. Registration or login required. |
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Synchronous Dynamic Random Access Memory (SDRAM) |
SDRAM3.11 | Jun 1994 |
Release No. 9 Committee(s): JC-42.3 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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Standard Template for JEDEC Module Standards |
MODULE4.20.1 | Oct 2001 |
Release No. 11 Committee(s): JC-42.5 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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STANDARD MANUFACTURERS IDENTIFICATION CODE |
JEP106BK | Sep 2024 |
The manufacturers identification code is defined by one or more 8 bit fields, each consisting of 7 data bits plus 1 odd parity bit. The manufacturers identification code is assigned, maintained and updated by the JEDEC Office. The intent of this identification code is that it may be used whenever a digital field is required, e.g., hardware, software, documentation, etc. To make a request for an ID Code please go to https://www.jedec.org/standards-documents/id-codes-order-form Free download. Registration or login required. |
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STANDARD FOR 64K x 1 DYNAMIC RAM - SUPERSEDED BY JESD21-C.Status: RescindedApr-85 |
JEP102 | Jan 1978 |
Committee(s): JC-42 |
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SRAM Introduction |
SRAM3.7 | Oct 2001 |
Release No. 11 Committee(s): JC-42.2 JESD21-C Solid State Memory Documents Main Page Free download. Registration or login required. |
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SPI Safety Extensions (CRC) for Non Volatile SPI Flash Memories (QPI and xSPI) |
JESD255 | Mar 2024 |
The JESD255 document defines CRC modes supported with 8-bit aligned and 16-bit aligned data transactions. It is limited to logical bus transactions and does not cover the electrical properties of the IO bus. Free download. Registration or login required. |