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This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2.0 Specification or later.

Committee(s): JC-40, JC-45

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This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5020 refers to the device specified by this document.

The purpose is to provide a standard for the PMIC5020 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40, JC-40.1

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This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS521X and TS511X refers to the device specified by this document.

Committee(s): JC-40.1

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This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as

used for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40.1

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Terminology update.  

This FBDIMM DFx standard covers Design for Test, Design for Manufacturing, and Design for Validation (“DFx”) requirements and implementation guidelines for Fully Buffered DIMM technology.

Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents.

Committee(s): JC-40, JC-40.5

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This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR5 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR5 RDIMM and LRDIMM applications. The DDR5RCD03 Device ID is DID = 0x0053.

Committee(s): JC-40, JC-40.5

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Terminology update.
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTU32S869 and SSTU32D869 registered buffer with parity for driving heavy load on high-density DDR2 RDIMM applications. A typical application would be a 36 SDRAM planar DIMM.

Committee(s): JC-40

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Terminology update. 
This standard includes four chapters of the FBD Channel Specification (cover) Channel Overview (Chapter 2), Initialization (Chapter 3), Channel Protocol (Chapter 4), and Reliability, Availability, and Serviceability (RAS) (Chapter 5).

Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents.

Committee(s): JC-40

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Terminology update.
This device is a one-chip spectrum analyzer that operates in the frequency range from 1 to 2 GHz.It requires no external components except some filtering of the voltage supply (one inductor, one bypass capacitor).
The frequency of the VCO is adjusted by an internal DAC. No PLL loop is used to lock the VCO to a reference frequency. A counter is used to determine the VCO frequency.

Committee(s): JC-40, JC-40.4

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 Terminology update.

This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32865 registered buffer with parity for 2 rank by 4 or similar high density DDR2 RDIMM applications. The SSTUB32865 is identical in functionality to the SSTU32865 but specifies tighter timing characteristics and a higher application frequency of up to 410 MHz.

Committee(s): JC-40

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Terminology update.
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTE32882 registered buffer with parity for driving address and control nets on DDR3/DDR3L/DDR3U RDIMM applications.

The purpose is to provide a standard for the SSTE32882 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40, JC-40.3, JC-40.4

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Terminology update.

This document defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the DDR4 Registering Clock Driver (RCD) with parity for driving address and control nets on DDR4 RDIMM and LRDIMM applications.

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-40.4

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Terminology update.  
This standard defines standard specifications of DC interface parameters, switching parameters, and test loading for definition of the SSTUB32868 registered buffer with parity test for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTUB32868 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40

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This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole. Information critical to a Advanced Memory Buffer design appears in the other specifications, with specific cross-references provided.

Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents.

Committee(s): JC-40

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This standard defines standard specifications for features and functionality, DC & AC interface parameters and test loading for definition of the DDR5 data buffer for driving DQ and DQS nets on DDR5 LRDIMM applications. The purpose is to provide a standard for the DDR5DB01 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Item 323.98K

Committee(s): JC-40.4

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUA32S865 and SSTUA32D865 registered buffer with parity for 2 rank by 4 or similar high-density DDR2 RDIMM applications. This is a minor editor revision as shown in Annex A of the document.

Committee(s): JC-40

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the SSTUA32866 registered buffer with parity test for DDR2 RDIMM applications. The purpose is to provide a standard for the SSTUA32866 (see Note) logic device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. This is a minor editorial revision as shown in Annex A of the document.

Committee(s): JC-40, JC-40.3

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This standard provides the functional definition, ball-out configuration and package outline, signal definitions and input/output characteristics for a 28-bit 1:2 registered driver with parity suitable for use on DDR2 RDIMMs. The SSTU32865 integrates the functional equivalent of two SSTU32864 devices (as defined in JESD82-7) into a single device, thereby easing layout and board design constraints especially on high density RDIMMs such as dual rank, by four configurations. Moreover, the optional use of a parity function is provided for, permitting detection and reporting of parity errors across its 22 data inputs. JESD82-9 specifies a 160-pin Thin-profile, fine-pitch ball-grid array (TFBGA) package. This is a minor editorial revision as shown in Annex A of the document.

Committee(s): JC-40, JC-40.4

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This standard defines standard specifications for features and functionality, DC and AC interface parameters and test loading for definition of the DDR4 data buffer for driving DQ and DQS nets on DDR4 LRDIMM applications. Any TBDs as of this document, are under discussion by formulating committee. Item 314.11D

*If you downloaded this file between 8/7/2019 and 8/14/2019, please download again, the publication date on the document was incorrected and has been fixed.

Patents(): A complete list of Assurance/Disclosure Forms is available to JEDEC members in the Members Area. Non-members can obtain individual Assurance/Disclosure Forms on request from the JEDEC office.

Committee(s): JC-40.4

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of the CUA877 and CU2A877 PLL clock devices for registered DDR2 DIMM applications.The purpose is to provide a standard for the CUA877 and CU2A877 PLL clock devices, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40

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This standard defines device pinouts for 14-, 16-, 20-, and 24-lead logic functions. This pinout standard specifically applies to the conversion of DIP-packaged logic devices to PSO-N/PQFN packages logic devices

The purpose of this standard is to provide a pinout standard for 14-, 16-, 20-, and 24-lead logic devices offered in 14-, 16-, 20-, and 24-lead PSO-N/PQFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use

Committee(s): JC-40, JC-40.1

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This standard defines standard specifications of dc interface parameters, switching parameters, and test loading for definition of a CUA878 PLL clock device for registered DDR2 DIMM applications. The purpose is to provide a standard for a CUA878 PLL clock device, for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40

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This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to SON/QFN packaged 1-, 2- and 3-bit logic devices.

The purpose of this document is to provide a pinout standard for 1-, 2- and 3-bit logic devices offered in 5-, 6- or 8-land SON/QFN packages for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

Committee(s): JC-40, JC-40.1

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This standard defines device pinout for 1-, 2- and 3-bit wide logic functions. This pinout specifically applies to the conversion of Dual-Inline-Packaged (DIP) 1-, 2- and 3-bit logic devices to DSBGA-packaged 1-, 2- and 3-bit logic devices.

Committee(s): JC-40

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This standard defines skew specifications and skew testing for standard logic devices. The purpose is to provide a standard for specifications to achieve uniformity, multiplicity of sources, elimination of confusion, and ease of device specification and design by users.

Committee(s): JC-40

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This standard provides a set of uniform data sheet parameters for the description of a single 10-bit, 2.5 V FET transmission-gate bus switch device for DDR memory module and motherboard applications. This bus switch device has a low ON resistance allowing inputs to be connected directly to outputs, with near zero propagation delay.

Committee(s): JC-40, JC-40.2

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This standard establishes a 54 Ball Grid Array pinout for 16, 18 and 20-bit standard logic devices that are currently being produced in 48 and 56 Pin SSOP and TSSOP packages. The 54 Ball Grid Array Package is organized as a 6 x 9 array with balls on a .8mm x .8mm grid pitch.

Committee(s): JC-40

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This standard covers specifications for a family of 3.3 V NMOS FET bus switch devices. Not included in this document are device specific parameters and performance levels that the vendor must also supply for full device description. The purpose of this document is to provide a set of uniform data sheet parameters for the description of bus switch devices. This standard includes required parameters, test conditions, test levels, and measurement methods for data sheet descriptions of bus switch devices.

Committee(s): JC-40

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This standard defines the register support devices needed for standard height and low profile registered PC133 SDRAM DIMM modules. The objective of the standard is to clearly define the functionality, pinout and electrical characteristics required for this type of SDRAM module.

Committee(s): JC-40

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