Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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FBDIMM: ARCHITECTURE AND PROTOCOL |
JESD206.01 | Feb 2023 |
Terminology update. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required. |
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FBDIMM: ADVANCED MEMORY BUFFER (AMB) |
JESD82-20A.01 | Jan 2023 |
This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole. Information critical to a Advanced Memory Buffer design appears in the other specifications, with specific cross-references provided. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Committee(s): JC-40 Free download. Registration or login required. |
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Fully Buffered DIMM Design for Test, Design for Validation (DFx) |
JESD82-28A.01 | Mar 2023 |
Terminology update. This FBDIMM DFx standard covers Design for Test, Design for Manufacturing, and Design for Validation (“DFx”) requirements and implementation guidelines for Fully Buffered DIMM technology. Patents(): There are known patent issues that are common to all FBDIMM related specifications. See document for link to FBDIMM Patents. Free download. Registration or login required. |
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INSTRUMENTATION CHIP DATA SHEET FOR FBDIMM DIAGNOSTIC SENSELINES |
JESD82-22.01 | Feb 2023 |
Terminology update. Free download. Registration or login required. |
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JEDEC® Memory Controller Standard – for Compute Express Link® (CXL®) |
JESD319 | Sep 2024 |
This standard defines the overall specifications, interface parameters, signaling protocols, and features for a CXL® Memory Controller ASIC. The standard includes pinout information, functional description, and configuration interface. This standard, along with other Referenced Specifications, should be treated as a whole for the purposes of defining overall functionality for CXL® Memory Controller (referred to as CMC). Committee(s): JC-40 Free download. Registration or login required. |
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JEDEC® Memory Device Management Standard – for Compute Express Link® (CXL®) |
JESD325 | Sep 2024 |
This standard provides a reference specification for systems and device management capabilities found in CXL memory devices. It is intended to target, but may not be limited to, CXL memory FRUs that are based on PCIe Gen 5 and compliant to the CXL 2.0 Specification or later. Free download. Registration or login required. |
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LATCH-UP IN CMOS INTEGRATED CIRCUITS - SUPERSEDED BY JESD78, February 1999Status: RescindedFebruary 1999 |
JESD17 | Aug 1988 |
This document is no longer available via the JEDEC website to obtain a copy please contact JEDEC. Committee(s): JC-40.2 Free download. Registration or login required. |
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LRDIMM DDR3 MEMORY BUFFER (MB) |
JESD82-30.01 | Jan 2023 |
Terminology update. The Load Reduced DIMM (LRDIMM) Memory Buffer (MB) supports DDR3 SDRAM main memory. The Memory Buffer allows buffering of memory traffic to support large memory capacities. Unlike DDR3 Register Buffer (SSTE32882), which only buffers Command, Address, Control and Clock, the LRDIMM Memory Buffer also buffers the Data (DQ) interface between the Memory Controller and the DRAM components. Free download. Registration or login required. |
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PMIC5020 Power Management IC StandardRelease Number: Version 1.0.1 |
JESD301-4 | Apr 2024 |
This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5020 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5020 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Free download. Registration or login required. |
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PMIC50x0 Power Management IC Standard |
JESD301-1A.02 Rev. 1.8.5 | Apr 2023 |
This standard defines the specifications of interface parameters, signaling protocols, and features for PMIC device as used for memory module applications. The designation PMIC5000, PMIC5010 refers to the device specified by this document. The purpose is to provide a standard for the PMIC5000, PMIC5010 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use. Committee(s): JC-40.1 Free download. Registration or login required. |