Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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THERMAL RESISTANCE AND THERMAL IMPEDANCE TEST METHODS FOR STUD AND BASE-MOUNTED RECTIFIER DIODES AND THYRISTORSStatus: Rescinded |
JEP88 | Jan 1974 |
Committee(s): JC-22.1 |
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HANDLING AND INSTALLATION OF POWER SEMICONDUCTORS IN DISC TYPE PACKAGES: Included in JESD282 and EIA397.Status: RescindedJun-92 |
TENTSTD11 | Jan 1973 |
Committee(s): JC-22.2 |
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STANDARD FOR SELENIUM SURGE SUPPRESSORS: |
TENTSTD12 | Nov 1973 |
The suppresser furnished under this standard shall be a product that has been tested and meets the definitions and minimum requirements specified herein. Committee(s): JC-22.5 |
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Registration Data Format (RDF) Homepage |
RDF Homepage | Aug 2007 |
RDF's contain Engineering information in the form of a list of specific electrical and mechanical parameters necessary for the characterization of a particular class of solid state devices. These documents are maintained by the JC-22 Committee. Committee(s): JC-22.2 |
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DEFINITION OF EXTERNAL CLEARANCE AND CREEPAGE DISTANCES OF DISCRETE SEMICONDUCTOR PACKAGES FOR THYRISTORS AND RECTIFIER DIODES:Status: ReaffirmedJanuary 1991, April 1999, April 2002, November 2011 |
JESD4 | Nov 1983 |
This standard defines reference distances between terminals of the device and the external package at specific voltages. Committee(s): JC-22.2 Free download. Registration or login required. |