Global Standards for the Microelectronics Industry
Standards & Documents Search
| Title | Document # | Date |
|---|---|---|
AIR-CONVECTION-COOLED, LIFE TEST ENVIRONMENT FOR LEAD-MOUNTED SEMICONDUCTOR DEVICES:Status: ReaffirmedFebruary 1972, November 2002 |
EIA323 | Mar 1966 |
This standard is applicable to life testing of lead-mounted semiconductor devices intended for applications in a natural air-cooled environment where most of the power dissipation is obtained by convection and radiation losses from the body to the device. Committee(s): JC-22.1 Free download. Registration or login required. |
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ADDENDUM No. 1 TO EIA-397: |
EIA397-1 | Jul 1980 |
A compilation of 12 new or revised thyristor test methods which have been adopted since the original standard was issued in 1972. Committee(s): JC-22.1 Free download. Registration or login required. |
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SEMICONDUCTOR POWER CONTROL MODULES:Status: ReaffirmedJune 1992, April 1999, April 2002 |
JESD14 | Nov 1986 |
Semiconductor Power Control Modules (SPCM) are modules consisting of thyristors or transistors, or both, as the primary controlling elements. Methods of manufacture of semiconductor power control modules include the assembling of individual components and the use of semiconductor hybrids or monolithic processing technologies, or both. Committee(s): JC-22.2 Free download. Registration or login required. |
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REVERSE RECOVERY CHARACTERISTICS OF SILICON DIODES: RESCINDED June 2002.Status: Rescinded |
JESD41 | May 1995 |
Committee(s): JC-22.1 Free download. Registration or login required. |
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MEASUREMENT METHOD FOR THERMAL RESISTANCE OF BRIDGE RECTIFIER ASSEMBLIES: RESCINDED, June 2002. Replaced by JESD282-B.Status: RescindedJune 2002 |
JESD45 | Dec 1994 |
Committee(s): JC-22.2 Free download. Registration or login required. |
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