Standards & Documents Search

Displaying 1 - 5 of 170 documents. Show 5 | 10 | 20 | 40 | 60 results per page.

Title	Document #	Date
WIRE BOND SHEAR TEST	JESD22-B116B	May 2017
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. Pictures have been added to enhance the fail mode diagrams. The wire bond shear test is destructive. The test method can also be used to shear aluminum and copper wedge bonds to a die or package bonding surface. It is appropriate for use in process development, process control and/or quality assurance. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Wire Bond Pull Test Methods	JESD22-B120.01	Sep 2024
This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
VIBRATION, VARIABLE FREQUENCY	JESD22-B103B.01	Sep 2016
The Vibration, Variable Frequency Test Method is intended to determine the ability of component(s) to withstand moderate to severe vibration as a result of motion produced by transportation or filed operation of electrical equipment. This is a destructive test that is intended for component qualification. This is a minor editorial change to JESD22-B103B, June 2002 (Reaffirmed September 2010). Committee(s): JC-14.1 Free download. Registration or login required.
USER GUIDE FOR MICROCIRCUIT FAILURE ANALYSIS: Status: RescindedNovember 2004	JEB16	Jul 1970
This guide defines generalized procedures for the failure analysis of monolithic integrated microelectronic circuits. Although the generalized procedural steps may apply to all microelectronic circuits, additional analysis steps unique to thin/thick film hybrid devices are not covered. Committee(s): JC-14 Free download. Registration or login required.
UNDERSTANDING ELECTRICAL OVERSTRESS - EOS Status: Reaffirmed May 2022	JEP174	Sep 2016
This purpose of this white paper will be to introduce a new perspective about EOS to the electronics industry. As failures exhibiting EOS damage are commonly experienced in the industry, and these severe overstress events are a factor in the damage of many products, the intent of the white paper is to clarify what EOS really is and how it can be mitigated once it is properly comprehended. Committee(s): JC-14.3 Free download. Registration or login required.

Pages