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Title	Document #	Date
USER GUIDE FOR MICROCIRCUIT FAILURE ANALYSIS: Status: RescindedNovember 2004	JEB16	Jul 1970
This guide defines generalized procedures for the failure analysis of monolithic integrated microelectronic circuits. Although the generalized procedural steps may apply to all microelectronic circuits, additional analysis steps unique to thin/thick film hybrid devices are not covered. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14 Free download. Registration or login required.
SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES Status: Reaffirmed October 1988, September 1996, September 2009, May 2018, October 2024	JESD471	Feb 1980
This standard will be useful to anyone engaged in handling semiconductor devices and integrated circuits that are subject to permanent damage due to electrostatic potentials. The standard establishes a symbol and label that will gain the attention of those persons who might inflict electrostatic damage to the device. The label which is placed on the lowest practical level of packaging contains the words 'ATTENTION - OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES'. The symbol contained in this label, which may be used on the device itself, shows a hand in a triangle with a bar through it. Formerly known as EIA-471. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
GUIDELINES FOR THE MEASUREMENT OF THERMAL RESISTANCE OF GaAs FETS:	JEP110	Jul 1988
This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.7 Free download. Registration or login required.
HIGH TEMPERATURE CONTINUITY Status: Rescinded November 1999	JESD22-C100-A	Jan 1990
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14.1
DISTRIBUTOR REQUIREMENTS FOR HANDLING ELECTROSTATIC -DISCHARGE SENSITIVE (ESDS) DEVICES: SUPERSEDED BY JESD42, March 1994. Status: Superseded	JEP108-B	Apr 1991
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.

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