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Title	Document #	Date
Foundry Process Qualification Guidelines – Technology Qualification Vehicle Testing (Wafer Fabrication Manufacturing Sites)	JEP001-3B	Sep 2024
The publication provides methodologies for measurements to qualify a new semiconductor wafer process. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.
Guidelines for Visual Inspection and Control of Flip Chip Type Packages (FCxGA)	JEP170A	Jun 2024
This document provides guidelines for visual inspection and control that ensures quality and reliability of flip chip packaged devices. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Board Level Drop Test Method of Components for Handheld Electronic Products	JESD22-B111A.01	Jun 2024
This Test Method standardizes the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
Information Requirements for the Qualification of Solid State Devices	JESD69D	Jun 2024
This standard defines the requirements for the device qualification package, which the supplier provides to the customer. Committee(s): JC-14, JC-14.3 Free download. Registration or login required.
Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly	J-STD-609C.01	Apr 2024
This standard applies to components and assemblies that contain Pb-free and Pb-containing solders and finishes, and it describes the marking and labeling of their shipping containers to identify their 2nd level terminal finish or material. Committee(s): JC-14, JC-14.4 Free download. Registration or login required.

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