Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINEStatus: Reaffirmed February 2023 |
JP002 | Mar 2006 |
This document will provide insight into the theory behind tin whisker formation as it is known today and, based on this knowledge, potential mitigation practices that may delay the onset of, or prevent tin whisker formation. The potential effectiveness of various mitigation practices will also be briefly discussed. References behind each of the theories and mitigation practices are provided. Free download. Registration or login required. |
||
USER GUIDE FOR MICROCIRCUIT FAILURE ANALYSIS:Status: RescindedNovember 2004 |
JEB16 | Jul 1970 |
This guide defines generalized procedures for the failure analysis of monolithic integrated microelectronic circuits. Although the generalized procedural steps may apply to all microelectronic circuits, additional analysis steps unique to thin/thick film hybrid devices are not covered. Committee(s): JC-14 Free download. Registration or login required. |
||
DISTRIBUTOR REQUIREMENTS FOR HANDLING ELECTROSTATIC -DISCHARGE SENSITIVE (ESDS) DEVICES: SUPERSEDED BY JESD42, March 1994.Status: Superseded |
JEP108-B | Apr 1991 |
Free download. Registration or login required. |
||
GUIDELINES FOR THE MEASUREMENT OF THERMAL RESISTANCE OF GaAs FETS: |
JEP110 | Jul 1988 |
This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET. Committee(s): JC-14.7 Free download. Registration or login required. |
||
GUIDELINES FOR USER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS - SUPERSEDED BY JESD46, August 1997.Status: Rescinded |
JEP117 | Apr 1994 |
Committee(s): JC-14.4 Free download. Registration or login required. |