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Title Document # Date

Wire Bond Pull Test Methods

 JESD22-B120.01 Sep 2024

This test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package bonding surface and may be performed on pre-encapsulation or post-encapsulation devices. 

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Survey On Latch-Up Testing Practices and Recommendations for Improvements

 JEP193 Jan 2023

This is a re-publication of a white paper which reports on a survey that has been conducted to better understand how the latch-up standard JESD78 revision E (JESD78E) is interpreted and has been used in the industry.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Joint ESDA/JEDEC - CDM Technical User Guide

 JTR002-01-22 Jan 2023

This report only covers the procedures and requirements specified in ANSI/ESDA/JEDEC JS-002.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-A100B Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts.  This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

Part Model Supply Chain Guidelines for Electronic-Device Packages – XML Requirements

 JEP30-S100A Aug 2024

This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model.

For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14.4

Free download. Registration or required.

A Case for Lowering Component-level CDM ESD Specifications and Requirements Part II: Die-to-Die Interfaces

 JEP196 Nov 2023

This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces.

Committee(s): JC-14, JC-14.3

Free download. Registration or required.

Test Method for Total Ionizing Dose (TID) from X-ray Exposure in Terrestrial Applications

 JESD22-B121 Nov 2023

This test method covers X-ray imaging for terrestrial applications on packaged devices.

Committee(s): JC-14, JC-14.1

Free download. Registration or required.

Gate Dielectric Breakdown

 JESD263 Mar 2024

This document describes procedures developed for estimating the overall integrity of gate dielectrics.

JESD263 supersedes these other 4 standards: JESD35A, JESD35-1 ADDENDUM, JESD35-2 and JESD92.

Committee(s): JC-14, JC-14.2

Free download. Registration or required.

Procedure for Reliability Characterization of Metal-Insulator-Metal Capacitors

 JEP199 Apr 2024

This document defines the standards for achieving Reliability certification and qualification of on-chip MIM Capacitors and MIS Trench Capacitors.

Committee(s): JC-14, JC-14.2

Free download. Registration or required.

PART MODEL SCHEMAS

 JEP30-10v6-0-0 Aug 2024

This download includes all files under the parent schema JEP30-10v6-0-0 (Committees: JC-11, JC-11.2) including:

  • JEP30-A101v2-0-3 (Assembly Process),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-E101v4-0-0 (Electrical),
    • Committees: JC-11, JC-11.2, JC-16
  • JEP30-P101v6-0-0 (Package),
    • Committees: JC-11, JC-11.2
  • JEP30-S101v1-0-3 (Supply Chain),
    • Committees: JC-11, JC-11.2, JC-14
  • JEP30-T101v2-0-3 (Thermal)
    • Committees: JC-11, JC-11.2, JC-15
  • JEP30-D10v4-0-1 (Types Dictionary)
    • Committees: JC-11, JC-11.2

This will enable the user to validate the schemas. For more information visit the main JEP30 webpage.

Committee(s): JC-11, JC-11.2, JC-14, JC-15, JC-16

Free download. Registration or required.

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