Standards & Documents Search

Displaying 1 - 4 of 4 documents.

Title	Document #	Date
A PROCEDURE FOR MEASURING P-CHANNEL MOSFET NEGATIVE BIAS TEMPERATURE INSTABILITIES	JESD90	Nov 2004
This document describes an accelerated stress and test methodology for measuring device paramete changes of a single p-channel MOSFET after Negative Bias Temperature Instability (NBTI) stress at dc bias conditions. This document gives a procedure to investigate NBTI stress in a symmetric voltage condition with the channel inverted (VGS < 0) and no channel conduction (VDS = 0).There can be NBTI degradation during channel conduction (VGS < 0, VDS < 0), however, this document does not cover this phenomena. Committee(s): JC-14, JC-14.2 Free download. Registration or login required.
POWER AND TEMPERATURE CYCLING	JESD22-A105D	Jan 2020
The power and temperature cycling test is performed to determine the ability of a device to withstand alternate exposures at high and low temperature extremes and simultaneously the operating biases are periodically applied and removed. It is intended to simulate worst case conditions encountered in application environments. The power and temperature cycling test is considered destructive and is only intended for device qualification. This test method applies to semiconductor devices that are subjected to temperature excursions and required to power on and off during all temperatures. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
THERMAL SHOCK	JESD22-A106B.01	Nov 2016
This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes. Committee(s): JC-14.1 Free download. Registration or login required.
TEMPERATURE, BIAS, AND OPERATING LIFE	JESD22-A108F	Jul 2017
This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the devices’ operating condition in an accelerated way, and is primarily for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn-in, may be used to screen for infant mortality related failures. The detailed use and application of burn-in is outside the scope of this document. Committee(s): JC-14.1 Available for purchase: $54.00 Add to Cart To help cover the costs of producing standards, JEDEC is now charging for non-member access to selected standards and design files. Most of the content on this site remains free to download with registration. Paying JEDEC member companies enjoy free access to all content. Learn more and apply today. Paying JEDEC Members may login for free access.