Global Standards for the Microelectronics Industry
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Document # | Date |
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POWER CYCLING |
JESD22-A122A | Jun 2016 |
This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application. Free download. Registration or login required. |