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Displaying 6 - 8 of 8 documents. Show 5 results per page.

Title	Document #	Date
JOINT IPC/JEDEC Standard for Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices	J-STD-035A	Dec 2022
This method provides users with an acoustic microscopy process flow for detecting anomalies (delaminations, cracks, mold compound voids, etc.) nondestructively in encapsulated electronic devices while achieving reproducibility. Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
CUSTOMER NOTIFICATION STANDARD FOR PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS	J-STD-046	Jul 2016
This standard is applicable to suppliers of, and affected customers for, electronic products and their constituent components. This standard establishes the requirements for timely customer notification of changes to electronic products and associated processes. This document replaces JESD46. Committee(s): JC-14.4 Free download. Registration or login required.
CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES	J-STD-075A	May 2018
This is a Joint Standard between ECIA, IPC, and JEDEC. The purpose of this standard is to establish an agreed set of worst case solder process limits (SnPb and Pb-free) which can safely be used for assembling non-semiconductor electronic components on common substrates, e.g., FR4, ceramic, polyimide, etc., along with documenting unique commodity specific exceptions. The documented process conditions are used to evaluate a non-semiconductor component’s PSL and MSL. THIS DOCUMENT IS NOT AVAILABLE FOR FREE DOWNLOAD. However, this document is available to the JEDEC formulating Committee members, in the Members Area. The lead organization is ECIA. Committee(s): JC-14

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