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Title	Document #	Date
GUIDELINES FOR THE MEASUREMENT OF THERMAL RESISTANCE OF GaAs FETS:	JEP110	Jul 1988
This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET. Committee(s): JC-14.7 Free download. Registration or login required.
DISTRIBUTOR REQUIREMENTS FOR HANDLING ELECTROSTATIC -DISCHARGE SENSITIVE (ESDS) DEVICES: SUPERSEDED BY JESD42, March 1994. Status: Superseded	JEP108-B	Apr 1991
Committee(s): JC-14, JC-14.1 Free download. Registration or login required.
GUIDELINES FOR USER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS - SUPERSEDED BY JESD46, August 1997. Status: Rescinded	JEP117	Apr 1994
Committee(s): JC-14.4 Free download. Registration or login required.
GUIDELINES FOR THE PACKING, HANDLING, AND REPACKING OF MOISTURE-SENSITIVE COMPONENTS - SUPERSEDED BY J-STD-033, May 1999. Status: RescindedNovember 1999	JEP124	Dec 1995
Committee(s): JC-14.4 Free download. Registration or login required.
GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING:	JEP128	Nov 1996
This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally, any electrical tests that require wafer-probe card to make electrical contact to test structures. Widespread use of this guide will afford the efficient and cost-effective use of water-probe test stations because of the need for fewer probe cards and probe-card changes to accommodate the various test structures that may need to be tested. Committee(s): JC-14.2 Free download. Registration or login required.

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