Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # |
Date![]() |
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GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICESStatus: Rescinded |
JEP96 | Jan 1977 |
Committee(s): JC-13.5 |
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STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITSStatus: Rescinded, October 2008 |
JESD390A | Feb 1981 |
Reaffirmed September 2003 Free download. Registration or login required. |
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JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP105 | Apr 1983 |
Committee(s): JC-13.5 Free download. Registration or login required. |
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TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP107 | Apr 1985 |
Committee(s): JC-13.5 Free download. Registration or login required. |
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TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.Status: RescindedJun-96 |
JEP111 | Jan 1986 |
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP112 | Jun 1987 |
Committee(s): JC-13 Free download. Registration or login required. |
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GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-AStatus: Rescinded |
JESD19 | Jul 1988 |
Committee(s): JC-13 Free download. Registration or login required. |
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GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001Status: Rescinded |
JESD26-A | Apr 1990 |
Committee(s): JC-13.2 Free download. Registration or login required. |
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CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES - SUPERSEDED BY JESD9B, May 2011.Status: Rescinded, May 2011 |
JESD27 | Aug 1993 |
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance. Free download. Registration or login required. |
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REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994.Status: Superseded |
JESD42 | Mar 1994 |
Committee(s): JC-13 Free download. Registration or login required. |
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PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORSStatus: Rescinded May 2006 |
EIA623 | Jul 1994 |
Committee(s): JC-13 Free download. Registration or login required. |
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PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994Status: Superseded |
JESD40 | Jul 1994 |
Committee(s): JC-13 Free download. Registration or login required. |
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GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:Status: Rescinded |
JEP109-C | Mar 1995 |
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Free download. Registration or login required. |
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JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITSStatus: Rescinded, May 2006 |
JEP101-C | Nov 1995 |
Committee(s): JC-13.2 Free download. Registration or login required. |
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MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002Status: RescindedOctober 2002 |
JESD53 | Jan 1996 |
Free download. Registration or login required. |
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GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTS:Status: ReaffirmedSeptember 2009 |
JEP142 | May 2002 |
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Free download. Registration or login required. |
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SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES:Removed 01/21/04 Release Number: B |
J-STD-002 | Feb 2003 |
At the request of IPC, J-STD-002B has been removed from the free download area. In its place, JEDEC's Test Method, JESD22-B102, Solderability, which includes lead-free, was made available until it was replaced by J-STD-002D. Any revision to J-STD-002 will no longer be available for free to the industry on the JEDEC website. However, the document is available to the JEDEC formulating Committee members, in the Members Area. If you are not a JEDEC member you may wish to try the IPC website or one of the resellers listed at: http://www.jedec.org/standards-document |
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HYBRIDS/MCMStatus: ReaffirmedJanuary 2009 |
JESD93 | Sep 2005 |
This specification establishes the general requirements for hybrid microcircuits, RF/microwave hybrid microcircuits and MCMs (hereafter referred to as devices). Detailed performance requirements for a specific device are specified in the applicable device acquisition document. In the event of a conflict between this document and the device acquisition document, the device acquisition document will take precedence. Free download. Registration or login required. |
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MEASUREMENT AND REPORTING OF ALPHA PARTICLE AND TERRESTRIAL COSMIC RAY INDUCED SOFT ERRORS IN SEMICONDUCTOR DEVICESStatus: ReaffirmedJanuary 2012 |
JESD89A | Oct 2006 |
This specification defines the standard requirements and procedures for terrestrial soft-error-rate (SER) testing of integrated circuits and reporting of results. Both real-time (unaccelerated) and accelerated testing procedures are described. At terrestrial, Earth-based altitudes, the predominant sources of radiation include both cosmic-ray radiation and alpha-particle radiation from radioisotopic impurities in the package and chip materials. An overall assessment of a deviceís SER is complete, only when an unaccelerated test is done, or accelerated SER data for the alpha-particle component and the cosmic-radiation component has been obtained. Free download. Registration or login required. |
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GUIDELINES FOR PARTICLE IMPACT NOISE DETECTION (PIND) TESTING, OPERATOR TRAINING, AND CERTIFICATIONStatus: ReaffirmedJanuary 2013 |
JEP114.01 | Oct 2007 |
This publication was developed to help the user of this test methodology avoid common interference ∆s to successful application. The guide contains sections on typical specification requirements, sources of particles, PIND test systems, calibration, maintenance, test interference's, operator training, particle recovery and failure analysis. Application of the information contained in the guide will improve the quality and affectivity for any PIND testing operation. Free download. Registration or login required. |