Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
---|---|---|
GUIDELINE FOR OBTAINING AND ACCEPTING MATERIAL FOR USE IN HYBRID/MCM PRODUCTSStatus: Reaffirmed May 2023 |
JEP142 | May 2023 |
This document provides guidance regarding design considerations, material assessment techniques, and recommendations for material acceptance prior to use in Hybrid/MCM Products. As part of the risk assessment process, both technical requirements and cost should be carefully considered with regard to testing/evaluating the elements of a hybrid microcircuit or Multi-chip Module (MCM) prior to material release for assembly. The intent of this document is to highlight various options that are available to the Hybrid / MCM manufacturer and provide associated guidance, not to impose a specific set of tests. Free download. Registration or login required. |
||
GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICESStatus: Rescinded |
JEP96 | Jan 1977 |
Committee(s): JC-13.5 |
||
Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification |
JEP114A | May 2023 |
This publication is a guideline to test facilities in their efforts to establish and maintain consistent particle impact noise detection (PIND) testing. Free download. Registration or login required. |
||
INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERSStatus: Reaffirmed May 2023 |
JESD9C | May 2017 |
The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: External Visual. Free download. Registration or login required. |
||
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001Status: Rescinded |
JEP105 | Apr 1983 |
Committee(s): JC-13.5 Free download. Registration or login required. |