Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENTReaffirmed June 2023 |
JESD213A | Apr 2017 |
This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended to be applied prior to delivery by the OCMs and may be used by OEM system engineers and procuring activities as well as U.S Government Department of Defense system engineers, procuring activities and repair centers. This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn/Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment. Reaffirmed June 2023
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-13 Free download. Registration or login required. |
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ALPHA RADIATION MEASUREMENT IN ELECTRONIC MATERIALS |
JESD221 | May 2011 |
This standard applies generally to gas proportional instruments and the use thereof in measuring materials with an alpha emissivity of less than 10 a·khr-1·cm-2. The primary focus will be on materials used in semiconductor fabrication. The purpose of this document is to specify the recommended method for measuring alpha emissivity in materials utilized in the manufacturing of semiconductors. The method specifically applies to gas proportional instruments and designates recommended instrument settings. In addition, the method discusses operation of ionization counters. The document also recommends methods for determining sample size and for evaluating instrument background accurately. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES - SUPERSEDED BY JESD9B, May 2011.Status: Rescinded, May 2011 |
JESD27 | Aug 1993 |
The intent of this standard is to be a guide in the manufacture and procurement of ceramic packages, especially for the hybrid industry. Manufacturers or ceramic packages and procuring activities for these packages will now be able to use this document as the means for agreement in the imposition of minimum requirements in qualification, screening, and quality conformance. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Free download. Registration or login required. |
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TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION: |
JESD57A | Nov 2017 |
This test method defines requirements and procedures for ground simulation and single event effects (SEE) and implementation of the method in testing integrated circuits. This standard is valid when using a cyclotron or Van de Graaff accelerator. Microcircuits under test must be delidded. The ions used at the facilities have an atomic number Z > 2. It does not apply to SEE testing that uses protons, neutrons, or other lighter particles. This standard is designed to eliminate any misunderstanding between users of the method and test facilities, to minimize delays, and to promote standardization of testing and test data. A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-13.4 Free download. Registration or login required. |
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JEDEC REQUIREMENTS FOR CLASS B MICROCIRCUITSStatus: Rescinded, May 2006 |
JEP101-C | Nov 1995 |
A list of RAND License Assurance/Disclosure Forms is available to JEDEC members on the restricted Members' website. Non-members may obtain individual Assurance/Disclosure forms by requesting them from the JEDEC office. Committee(s): JC-13.2 Free download. Registration or login required. |