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Title	Document #	Date
JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP105	Apr 1983
Committee(s): JC-13.5 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP107	Apr 1985
Committee(s): JC-13.5 Free download. Registration or login required.
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES: Status: Rescinded	JEP109-C	Mar 1995
Superseded by JESD31-A, June 2001. Committee(s): JC-13 Free download. Registration or login required.
TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001 Status: Rescinded	JEP112	Jun 1987
Committee(s): JC-13 Free download. Registration or login required.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:	JEP121B	Dec 2020
The purpose of this document provides the basis for the optimization of 100% screening/stress operations and sample inspection test activities. This document is designed to assist the manufacturer in optimizing the test flow while maintaining and/or improving assurance of providing high quality and reliable product in an efficient manner. This will allow for optimization of testing that is not adding value, hence, reducing cycle time and costs. Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
PROCESS CHARACTERIZATION GUIDELINE	JEP132A.01	Dec 2022
This guideline provides a methodology to characterize a new or existing process and is applicable to any manufacturing or service process. It describes when to use specific tools such as failure mode effects analysis (FEMA), design or experiments (DOE), measurement system evaluation (MSE), capability analysis (CpK), statistical process control (SPC), and problem solving tools. It also provides a brief description of each tool. Committee(s): JC-13 Free download. Registration or login required.
GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-A Status: Rescinded	JESD19	Jul 1988
Committee(s): JC-13 Free download. Registration or login required.
GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001 Status: Rescinded	JESD26-A	Apr 1990
Committee(s): JC-13.2 Free download. Registration or login required.
PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994 Status: Superseded	JESD40	Jul 1994
Committee(s): JC-13 Free download. Registration or login required.
REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994. Status: Superseded	JESD42	Mar 1994
Committee(s): JC-13 Free download. Registration or login required.
MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002 Status: RescindedOctober 2002	JESD53	Jan 1996
Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS: Status: Reaffirmed May 2023	JESD72A	Mar 2018
This Test Method covers the minimum requirements that should be in effect for the evaluation and acceptance of polymeric materials for use in industrial, military, space, and other special-condition products which may require capabilities beyond standard commercial microelectronics applications. It is not the intent of this Publication to specify a material, but to evaluate the material to assure that the quality and reliability of the microelectronic devices are not compromised. This document replaces JEP105, JEP107 and JEP112. Committee(s): JC-13.5 Free download. Registration or login required.
TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C. Status: RescindedJun-96	JEP111	Jan 1986
Committee(s): JC-13, JC-13.2
GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES Status: Rescinded	JEP96	Jan 1977
Committee(s): JC-13.5
GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:	JEP133C	Jan 2010
A revised and expanded publication for suppliers and users of radiation hardness assured (RHA) multichip modules (MCMs) and hybrid microcircuits, is now available. The document provides guidance as to how to achieve, maintain and ensure required levels of radiation-hardness given the fact that the constituent dice can have different levels of hardness assurance. It also describes how to deal with the various radiation hardness situations that an MCM/Hybrid developer, procuring activity or user will encounter. The guide is intended to supplement three relevant performance specifications: MIL-PRF-38534, MIL-PRF-38535 and MIL-PRF-19500. Committee(s): JC-13.5, JC-13.4 Free download. Registration or login required.
STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS Status: Rescinded, October 2008	JESD390A	Feb 1981
Reaffirmed September 2003 Committee(s): JC-13, JC-13.2 Free download. Registration or login required.
INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS Status: Reaffirmed May 2023	JESD9C	May 2017
The purpose of this JEDEC standard is to verify the workmanship and requirements of microelectronic packages and covers (lids) intended for use in fabricating hybrid microelectronic circuits/microcircuits (hereafter referred to as “microcircuits”). It is applicable for use by the package manufacturer (i.e., package components), and the microcircuit manufacturer (i.e., from incoming inspection of package components through final inspection of the completed microcircuit). This standard also encompasses and replaces JESD27, Ceramic Package Specification for Microelectronic Packages. It is meant to be used in conjunction, and to not contradict, with MIL-STD-883, Test Method 2009: External Visual. Committee(s): JC-13, JC-13.5 Free download. Registration or login required.
GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES Status: Reaffirmed November 2020	JEP144A	Nov 2011
This guideline is applicable to hermetically sealed microelectronic components (including discrete semiconductors, monolithic and hybrid microcircuits). Specific cases with unique packaging, materials, or environmental constraints may not find all of the following information and procedures applicable. Committee(s): JC-13 Free download. Registration or login required.
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)	JESD16B	Nov 2017
This standard was revised to clarify assumptions necessary to estimate AOQ, revise the minimum sample size algorithm, address small sample size concerns, and provide methods for combining groups for AOQ estimation. Derivation of any new methods for combing groups for AOQ estimation. Derivation of any new methods introduced into this document have been provided in annexes. A statistical method is based on confidence interval statistics. A procedure was established for reporting AOQ when the minimum sample size criterion is not met. Not all sections of EIA-554 are appropriate for use by device manufacturers therefore JEDEC wishes to continue using JESD16. In December 2008 the formulating committee approved to remove EIA-554 (July 1996, Reaffirmed September 2002) from the JEDEC website. To obtain a copy of EIA-554 please contact GEIA at http://www.geia.org/ Committee(s): JC-13 Free download. Registration or login required.
Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices	JESD625C.01	Mar 2024
This standard applies to devices susceptible to damage by electrostatic discharge greater than 100 volts human body model (HBM) and 200 volts charged device model (CDM). Committee(s): JC-13, JC-14.1 Free download. Registration or login required.

Standards & Documents Search

JEDEC GUIDELINE FOR THE CHARACTERIZATION OF HYBRID POLYMERIC MATERIALS - SUPERSEDED BY JESD72, June 2001

TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF PARTICLE GETTERS FOR USE IN HYBRID MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF MILITARY SEMICONDUCTOR DEVICES:

TEST METHOD FOR QUALIFICATION AND ACCEPTANCE OF CIRCUIT SUPPORT FILMS FOR USE IN MICROELECTRONIC APPLICATIONS - SUPERSEDED BY JESD72, June 2001

REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION:

PROCESS CHARACTERIZATION GUIDELINE

GENERAL STANDARD FOR STATISTICAL PROCESS CONTROL (SPC) - SUPERSEDED by EIA-557-A

GENERAL SPECIFICATION FOR PLASTIC ENCAPSULATED MICROCIRCUITS FOR USE IN RUGGED APPLICATIONS - RESCINDED, July 2001

PROCUREMENT QUALITY OF SOLID STATE COMPONENTS BY GOVERNMENT CONTRACTORS - SUPERSEDED BY EIA-623, July 1994

REQUIREMENTS FOR HANDLING ELECTROSTATIC-DISCHARGE-SENSITIVE (ESDS) DEVICES - SUPERSEDED BY EIA-625, November 1994.

MANAGEMENT OF COMPONENT OBSOLESCENCE BY GOVERNMENT CONTRACTORS: RESCINDED, October 2002

TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS:

TEST PROCEDURES FOR CUSTOM MONOLITHIC MICROCIRCUITS - SUPERSEDED BY MIL-PRF-38535C.

GUIDELINES FOR NONDESTRUCTIVE PULL TESTING OF WIRE BONDS ON HYBRID DEVICES

GUIDE FOR THE PRODUCTION AND ACQUISITION OF RADIATION-HARDNESS ASSURED MULTICHIP MODULES AND HYBRID MICROCIRCUITS:

STANDARD TEST PROCEDURE FOR NOISE MARGIN MEASUREMENTS FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS

INSPECTION CRITERIA FOR MICROELECTRONIC PACKAGES AND COVERS

GUIDELINE FOR INTERNAL GAS ANALYSIS FOR MICROELECTRONIC PACKAGES

ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)

Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

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